MCF54452VR266 Freescale Semiconductor, MCF54452VR266 Datasheet - Page 45

• Manufacturer Part Number: MCF54452VR266
• Description: IC MPU 32BIT 266MHZ 360TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF5445xr

Specifications of MCF54452VR266

• Core Processor: Coldfire V4
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 132
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 360-TEPBGA
• Family Name: MCF5445X
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 1.65/3.6V
• Operating Supply Voltage (min): 1.35/3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 360
• Package Type: TEBGA
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• For Use With: M54455EVB - BOARD EVAL FOR MCF5445X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

7
The latest package outline drawings are available on the product summary pages on http://www.freescale.com/coldfire.
Table 33
package outline drawings.
8
Documentation is available from a local Freescale distributor, a Freescale sales office, the Freescale Literature Distribution
Center, or through the Freescale world-wide web address at http://www.freescale.com/coldfire.
Freescale Semiconductor
lists the case outline numbers per device. Use these numbers in the web page’s keyword search engine to find the latest
325.0
300.0
275.0
250.0
225.0
200.0
175.0
150.0
125.0
100.0
75.0
50.0
25.0
Package Information
Product Documentation
0.0
166
Figure 34. IV
MCF54450
MCF54451
MCF54452
MCF54453
MCF54454
MCF54455
MCF5445x ColdFire
Device
200
System Frequency (MHz)
DD
Table 33. Package Information
Power Consumption in Low-Power Modes
Package Type
256 MAPBGA
360 TEPBGA
®
Microprocessor Data Sheet, Rev. 6
233
Case Outline Numbers
266
98ARH98219A
98ARE10605D
266 (peak)
Package Information
Run
Wait/Doze
Stop 0
Stop 1
Stop 2
Stop 3
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