A3P400-FGG484 Actel, A3P400-FGG484 Datasheet - Page 102

• Manufacturer Part Number: A3P400-FGG484
• Description: FPGA - Field Programmable Gate Array 400K System Gates
• Manufacturer: Actel

Specifications of A3P400-FGG484

• Processor Series: A3P400
• Core: IP Core
• Maximum Operating Frequency: 350 MHz
• Number Of Programmable I/os: 194
• Data Ram Size: 55296
• Delay Time: 11.1 ns
• Supply Voltage (max): 1.575 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: A3PE-Proto-Kit, A3PE-Brd1500-Skt, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 400 K
• Package / Case: FPBGA-484
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ProASIC3 DC and Switching Characteristics
Table 2-107 • A3P015 Global Resource
Table 2-108 • A3P030 Global Resource
2- 88
Parameter Description
t
t
t
t
t
F
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
3. For specific junction temperature and voltage-supply levels, refer to
Parameter
t
t
t
t
t
F
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
3. For specific junction temperature and voltage supply levels, refer to
RCKL
RCKH
RCKMPWH
RCKMPWL
RCKSW
RCKL
RCKH
RCKMPWH
RCKMPWL
RCKSW
RMAX
RMAX
located in a lightly loaded row (single element is connected to the global net).
loaded row (all available flip-flops are connected to the global net in the row).
located in a lightly loaded row (single element is connected to the global net).
loaded row (all available flip-flops are connected to the global net in the row).
Commercial-Case Conditions: T
Commercial-Case Conditions: T
Input Low Delay for Global Clock
Input High Delay for Global Clock
Minimum Pulse Width High for Global Clock
Minimum Pulse Width Low for Global Clock
Maximum Skew for Global Clock
Maximum Frequency for Global Clock
Input Low Delay for Global Clock
Input High Delay for Global Clock
Minimum Pulse Width High for Global Clock
Minimum Pulse Width Low for Global Clock
Maximum Skew for Global Clock
Maximum Frequency for Global Clock
Global Tree Timing Characteristics
Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not
include I/O input buffer clock delays, as these are I/O standard–dependent, and the clock may be driven
and conditioned internally by the CCC module. For more details on clock conditioning capabilities, refer
to the
present minimum and maximum global clock delays within each device. Minimum and maximum delays
are measured with minimum and maximum loading.
Timing Characteristics
"Clock Conditioning Circuits" section on page
Description
J
J
= 70°C, VCC = 1.425 V
= 70°C, V
R e visio n 9
CC
= 1.425 V
Min.
Min.
0.66
0.67
Table 2-6 on page 2-6
0.67
0.68
Table 2-6 on page 2-6
2-92.
1
1
–2
–2
Max.
Max.
0.81
0.84
0.18
Table 2-108
0.81
0.85
0.18
2
2
Min.
Min.
0.75
0.76
0.76
0.77
1
1
–1
–1
to
Max.
Max.
for derating values.
for derating values.
0.92
0.96
0.21
0.92
0.97
0.21
Table 2-114 on page 2-91
2
2
Min.
Min.
0.88
0.89
0.89
0.91
1
Std.
1
Std.
Max.
Max.
1.08
1.13
0.25
1.09
1.14
0.24
2
2
Units
Units
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns