STM32F103ZCT7 STMicroelectronics, STM32F103ZCT7 Datasheet - Page 107

• Manufacturer Part Number: STM32F103ZCT7
• Description: MCU ARM 32BIT 256KB FLSH 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZCT7

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

STM32F103xC, STM32F103xD, STM32F103xE
Figure 59. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
1. Drawing is not to scale.
Table 64.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
E
b
e
F
0.8 mm pitch, package outline
LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data
0.21
0.35
9.85
9.85
Min
C
Seating plane
A2
A4
B
millimeters
A3
M
10.00
10.00
Doc ID 14611 Rev 7
1.07
0.27
8.80
0.40
8.80
0.80
0.60
0.10
0.15
0.08
Typ
Ball A1
e
10.15
10.15
D1
Max
1.70
0.85
0.45
D
Øb
Ø
Ø
(144 balls)
eee M C A B
fff
F
M
0.0083
0.0138
0.3878
0.3878
C
Typ
F
e
E1 E
A
A
Package characteristics
ddd
A1
inches
0.0421
0.0106
0.0157
0.3937
0.3465
0.3937
0.3465
0.0315
0.0236
0.0039
0.0059
0.0031
Min
C
X3_ME
(1)
0.0669
0.0335
0.0177
0.3996
0.3996
Max
107/123