PIC18F2550T-I/SO Microchip Technology, PIC18F2550T-I/SO Datasheet - Page 421

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PIC18F2550T-I/SO

Manufacturer Part Number
PIC18F2550T-I/SO
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2550T-I/SO

Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI, I2C, EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163025, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRD
Lead Free Status / Rohs Status
 Details
APPENDIX A:
Revision A (May 2004)
Original data sheet for PIC18F2455/2550/4455/4550
devices.
Revision B (October 2004)
This revision includes updates to the Electrical Specifi-
cations in Section 28.0 “Electrical Characteristics”
and includes minor corrections to the data sheet text.
Revision C (February 2006)
This revision includes updates to Section 19.0 “Master
Synchronous
Section 20.0 “Enhanced Universal Synchronous
Asynchronous Receiver Transmitter (EUSART)” and
the Electrical Specifications in Section 28.0 “Electrical
Characteristics” and includes minor corrections to the
data sheet text.
TABLE B-1:
© 2009 Microchip Technology Inc.
Program Memory (Bytes)
Program Memory (Instructions)
Interrupt Sources
I/O Ports
Capture/Compare/PWM Modules
Enhanced Capture/Compare/
PWM Modules
Parallel Communications (SPP)
10-Bit Analog-to-Digital Module
Packages
Features
Serial
DEVICE DIFFERENCES
REVISION HISTORY
Port
(MSSP)
10 Input Channels
Ports A, B, C, (E)
PIC18F2455
28-Pin PDIP
28-Pin SOIC
24576
12288
No
19
2
0
Module”,
PIC18F2455/2550/4455/4550
10 Input Channels
Ports A, B, C, (E)
PIC18F2550
28-Pin SOIC
28-Pin PDIP
32768
16384
Revision D (January 2007)
This revision includes updates to the packaging
diagrams.
Revision E (August 2008)
This revision includes minor corrections to the data
sheet text. In Section 30.2 “Package Details”, added
land pattern drawings for both 44-pin packages.
APPENDIX B:
The differences between the devices listed in this data
sheet are shown in Table B-1.
No
19
0
2
Ports A, B, C, D, E Ports A, B, C, D, E
13 Input Channels
44-Pin TQFP
PIC18F4455
40-Pin PDIP
44-Pin QFN
24576
12288
Yes
20
DEVICE
DIFFERENCES
1
1
13 Input Channels
DS39632E-page 419
44-Pin TQFP
PIC18F4550
40-Pin PDIP
44-Pin QFN
32768
16384
Yes
20
1
1

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