CY7C1381D-133AXI Cypress Semiconductor Corp, CY7C1381D-133AXI Datasheet - Page 19

• Manufacturer Part Number: CY7C1381D-133AXI
• Description: IC,SYNC SRAM,512KX36,CMOS,QFP,100PIN,PLASTIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1381D-133AXI

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 18M (512K x 36)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2147; CY7C1381D-133AXI

AC Test Loads and Waveforms
Capacitance
Thermal Resistance
Document #: 38-05544 Rev. *F
Note:
C
C
C
Θ
Θ
19. Tested initially and after any design or process change that may affect these parameters.
Parameter
Parameter
3.3V IO Test Load
IN
CLK
IO
2.5V IO Test Load
JA
JC
OUTPUT
OUTPUT
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Z
Z
[19]
0
0
= 50Ω
= 50Ω
Description
Description
(a)
(a)
V
V
[19]
T
T
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
T
V
V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, in accordance with
EIA/JESD51.
3.3V
2.5V
A
DD
DDQ
= 25°C, f = 1 MHz,
INCLUDING
INCLUDING
= 3.3V.
JIG AND
= 2.5V
JIG AND
SCOPE
Test Conditions
Test Conditions
SCOPE
5 pF
5 pF
(b)
(b)
R = 317Ω
R = 1667Ω
R = 351Ω
R = 1538Ω
100 TQFP
100 TQFP
Package
Package
28.66
4.08
V
5
5
5
V
GND
GND
DDQ
DDQ
≤ 1 ns
≤ 1 ns
CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
10%
10%
119 BGA
119 BGA
Package
Package
23.8
6.2
8
8
8
ALL INPUT PULSES
ALL INPUT PULSES
90%
90%
165 FBGA
165 FBGA
Package
Package
(c)
(c)
20.7
4.0
9
9
9
Page 19 of 29
90%
90%
10%
10%
°C/W
°C/W
Unit
Unit
pF
pF
pF
≤ 1 ns
≤ 1 ns
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