CY7C1381D-133AXI Cypress Semiconductor Corp, CY7C1381D-133AXI Datasheet - Page 29

• Manufacturer Part Number: CY7C1381D-133AXI
• Description: IC,SYNC SRAM,512KX36,CMOS,QFP,100PIN,PLASTIC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1381D-133AXI

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 18M (512K x 36)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2147; CY7C1381D-133AXI

Document History Page
Document #: 38-05544 Rev. *F
Document Title: CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
Document Number: 38-05544
REV.
*C
*D
*A
*B
*E
*F
**
ECN NO. Issue Date
254518
288531
326078
351895
416321
475009
776456
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
Orig. of
Change
RKF
NXR
VKN
VKN
SYT
PCI
PCI
New data sheet
Edited description under “IEEE 1149.1 Serial Boundary Scan (JTAG)” for
non-compliance with 1149.1
Removed 117-MHz Speed Bin
Added Pb-free information for 100-Pin TQFP, 119 BGA and 165 FBGA
package
Added comment of ‘Pb-free BG packages availability’ below the Ordering Infor-
mation
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Added description on EXTEST Output Bus Tri-State
Changed description on the Tap Instruction Set Overview and Extest
Changed Device Width (23:18) for 119-BGA from 000001 to 101001
Added separate row for 165 -FBGA Device Width (23:18)
Changed Θ
4.08 °C/W respectively
Changed Θ
°C/W respectively
Changed Θ
°C/W respectively
Modified V
Removed comment of ‘Pb-free BG packages availability’ below the Ordering
Information
Updated Ordering Information Table
Changed from Preliminary to Final
Updated Ordering Information Table
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed the description of I
Current on page# 18
Changed the I
to –30 µA and 5 µA
Changed the I
to –5 µA and 30 µA
Changed V
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
Switching Characteristics table.
Updated the Ordering Information table.
Added Part numbers CY7C1381F and CY7C1383F and its related information
Added footnote# 3 regarding Chip Enable
Updated Ordering Information table
TH
OL,
JA
IH
JA
JA
, t
< V
and Θ
and Θ
and Θ
V
X
X
TL
OH
current values of MODE on page # 18 from –5 µA and 30 µA
current values of ZZ on page # 18 from –30 µA and 5 µA
DD
from 25 ns to 20 ns and t
test conditions
JC
JC
JC
to V
for FBGA Package from 46 and 3 °C/W to 20.7 and 4.0
for TQFP Package from 31 and 6 °C/W to 28.66 and
for BGA Package from 45 and 7 °C/W to 23.8 and 6.2
IH
Description of Change
< V
X
from Input Load Current to Input Leakage
DD
on page # 18
CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
TDOV
from 5 ns to 10 ns in TAP AC
DDQ
Relative to GND
Page 29 of 29
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