BAS101S,215 NXP Semiconductors, BAS101S,215 Datasheet

DIODE SW HI-VOLT DUAL SOT-23

BAS101S,215

Manufacturer Part Number
BAS101S,215
Description
DIODE SW HI-VOLT DUAL SOT-23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS101S,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1.1V @ 100mA
Current - Reverse Leakage @ Vr
150nA @ 250V
Current - Average Rectified (io) (per Diode)
200mA (DC)
Voltage - Dc Reverse (vr) (max)
300V
Reverse Recovery Time (trr)
50ns
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
600 V
Forward Continuous Current
100 mA
Max Surge Current
1 A
Configuration
Dual
Recovery Time
50 ns
Forward Voltage Drop
1.1 V
Maximum Reverse Leakage Current
150 nA
Maximum Power Dissipation
250 mW
Operating Temperature Range
- 65 C to + 150 C
Maximum Diode Capacitance
2 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934060849215
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted
Device (SMD) plastic package.
Table 1.
Table 2.
[1]
Type number
BAS101
BAS101S
Symbol
Per diode
I
I
V
t
F
R
rr
R
BAS101; BAS101S
High-voltage switching diodes
Rev. 02 — 14 December 2009
High switching speed: t
Low leakage current
Repetitive peak reverse voltage:
V
High-speed switching
High-voltage switching
When switched from I
RRM
≤ 300 V
Product overview
Quick reference data
Parameter
forward current
reverse current
reverse voltage
reverse recovery time
F
= 30 mA to I
Package
NXP
SOT23
SOT23
rr
≤ 50 ns
R
= 30 mA; R
Conditions
V
R
= 250 V
JEITA
-
-
L
= 100 Ω; measured at I
Low capacitance: C
Reverse voltage: V
Small SMD plastic package
Voltage clamping
Reverse polarity protection
[1]
Min
-
-
-
-
Configuration
single
dual series
R
= 3 mA.
Typ
-
-
-
-
Product data sheet
R
d
≤ 300 V
≤ 2 pF
Max
200
150
300
50
Unit
mA
nA
V
ns

Related parts for BAS101S,215

BAS101S,215 Summary of contents

Page 1

BAS101; BAS101S High-voltage switching diodes Rev. 02 — 14 December 2009 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package. Table 1. Type number BAS101 BAS101S 1.2 Features High switching ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin BAS101 BAS101S Ordering information Table 4. Type number BAS101 BAS101S 4. Marking Table 5. Type number BAS101 BAS101S [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS101_BAS101S_2 Product data sheet Pinning Description anode not connected cathode ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM Per device P tot amb T stg = 25 °C prior to surge [ [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

Page 4

... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol Parameter Per diode V forward voltage F I reverse current R C diode capacitance d t reverse recovery time rr [1] Pulse test: t [2] When switched from I BAS101_BAS101S_2 Product data sheet Characteristics C unless otherwise specified. Conditions I = 100 250 250 V; T ...

Page 5

... NXP Semiconductors 500 I F (mA) 400 300 200 (1) (2) 100 0 0 0.5 = 150 °C (1) T amb = 75 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values (μ −1 10 − 120 V = 300 V R Fig 3. Reverse current as a function of junction temperature ...

Page 6

... NXP Semiconductors 8. Test information D.U.T. I Ω × ( Fig 5. Reverse recovery time test circuit and waveforms 9. Package outline Fig 6. Package outline SOT23 (TO-236AB) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS101 ...

Page 7

... NXP Semiconductors 11. Soldering Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BAS101_BAS101S_2 Product data sheet 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 1.20 3 2.80 4.50 Rev. 02 — 14 December 2009 BAS101 ...

Page 8

... NXP Semiconductors 12. Mounting PCB thickness = 1.6 mm Fig 9. FR4 PCB, standard footprint SOT23 (TO-236AB) BAS101_BAS101S_2 Product data sheet BAS101; BAS101S 43.4 0.7 0.6 0.6 0.7 Dimensions in mm Rev. 02 — 14 December 2009 High-voltage switching diodes 40 0.5 006aaa527 © NXP B.V. 2009. All rights reserved. ...

Page 9

... Table 10. Revision history Document ID Release date BAS101_BAS101S_2 20091214 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Table 3 BAS101_BAS101S_1 20060908 BAS101_BAS101S_2 Product data sheet ...

Page 10

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 11

... NXP Semiconductors 16. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...

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