BAS101S,215 NXP Semiconductors, BAS101S,215 Datasheet - Page 7

• Manufacturer Part Number: BAS101S,215
• Description: DIODE SW HI-VOLT DUAL SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS101S,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.1V @ 100mA
• Current - Reverse Leakage @ Vr: 150nA @ 250V
• Current - Average Rectified (io) (per Diode): 200mA (DC)
• Voltage - Dc Reverse (vr) (max): 300V
• Reverse Recovery Time (trr): 50ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 600 V
• Forward Continuous Current: 100 mA
• Max Surge Current: 1 A
• Configuration: Dual
• Recovery Time: 50 ns
• Forward Voltage Drop: 1.1 V
• Maximum Reverse Leakage Current: 150 nA
• Maximum Power Dissipation: 250 mW
• Operating Temperature Range: - 65 C to + 150 C
• Maximum Diode Capacitance: 2 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934060849215

NXP Semiconductors
11. Soldering
BAS101_BAS101S_2
Product data sheet
Fig 7.
Fig 8.
4.60
4.00
Dimensions in mm
Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Wave soldering footprint SOT23 (TO-236AB)
1.20
3.00
0.85
0.85
1.30
Rev. 02 — 14 December 2009
2
2
3.40
2.80
4.50
3
1.00
2.90
2.50
3.30
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
MSA439
0.60
(3x)
BAS101; BAS101S
2.70
preferred transport direction during soldering
High-voltage switching diodes
solder lands
solder resist
occupied area
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2009. All rights reserved.
MSA427
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