DIODE SW 100V 215MA H-S SOD882

BAS16L,315

Manufacturer Part NumberBAS16L,315
DescriptionDIODE SW 100V 215MA H-S SOD882
ManufacturerNXP Semiconductors
BAS16L,315 datasheet
 


Specifications of BAS16L,315

Package / CaseSOD-882Voltage - Forward (vf) (max) @ If1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)100VCurrent - Average Rectified (io)215mA (DC)
Current - Reverse Leakage @ Vr500nA @ 80VDiode TypeStandard
SpeedFast Recovery =< 500ns, > 200mA (Io)Reverse Recovery Time (trr)4ns
Capacitance @ Vr, F1.5pF @ 0V, 1MHzMounting TypeSurface Mount
ProductSwitching DiodesPeak Reverse Voltage100 V
Forward Continuous Current215 mAMax Surge Current4 A
ConfigurationSingleRecovery Time4 ns
Forward Voltage Drop1.25 VMaximum Reverse Leakage Current1 uA
Operating Temperature Range+ 150 CMaximum Operating Temperature+ 150 C
Minimum Operating Temperature- 65 CMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names568-4859-2
934057247315
BAS16L T/R
BAS16L T/R
BAS16L,315
1
Page 1
2
Page 2
3
Page 3
4
Page 4
5
Page 5
6
Page 6
7
Page 7
8
Page 8
9
Page 9
10
Page 10
11
12
13
14
15
16
17
18
19
20
Page 1/20

Download datasheet (143Kb)Embed
Next
BAS16 series
High-speed switching diodes
Rev. 05 — 25 August 2008
1. Product profile
1.1 General description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1.
Type number
BAS16
BAS16H
BAS16J
BAS16L
BAS16T
BAS16VV
BAS16VY
BAS16W
BAS316
BAS516
1.2 Features
I
High switching speed: t
I
Low leakage current
I
Repetitive peak reverse voltage:
V
RRM
1.3 Applications
I
High-speed switching
I
General-purpose switching
Product overview
Package
NXP
JEITA
SOT23
-
SOD123F
-
SOD323F
SC-90
SOD882
-
SOT416
SC-75
SOT666
-
SOT363
SC-88
SOT323
SC-70
SOD323
SC-76
SOD523
SC-79
4 ns
rr
100 V
Product data sheet
Configuration
JEDEC
TO-236AB
single
-
single
-
single
-
single
-
single
-
triple isolated
-
triple isolated
-
single
-
single
-
single
I
Low capacitance
I
Reverse voltage: V
100 V
R
I
Small SMD plastic packages
Package
configuration
small
small and flat lead
very small and flat
lead
leadless ultra
small
ultra small
ultra small and flat
lead
very small
very small
very small
ultra small and flat
lead

BAS16L,315 Summary of contents

  • Page 1

    BAS16 series High-speed switching diodes Rev. 05 — 25 August 2008 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W ...

  • Page 2

    ... NXP Semiconductors 1.4 Quick reference data Table 2. Symbol Per diode [1] When switched from I 2. Pinning information Table 3. Pin BAS16; BAS16T; BAS16W BAS16H; BAS16J; BAS316; BAS516 1 2 BAS16L 1 2 BAS16VV; BAS16VY [1] The marking bar indicates the cathode. BAS16_SER_5 Product data sheet Quick reference data ...

  • Page 3

    ... NXP Semiconductors 3. Ordering information Table 4. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 4. Marking Table 5. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China ...

  • Page 4

    ... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM P tot BAS16_SER_5 Product data sheet Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current BAS16 BAS16H BAS16L ...

  • Page 5

    ... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line. ...

  • Page 6

    ... NXP Semiconductors Table 7. Symbol R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line. [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [5] Single diode loaded ...

  • Page 7

    ... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.4 0.6 0.8 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAS16_SER_5 Product data sheet 006aab132 ...

  • Page 8

    ... NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms 9. Package outline 3 ...

  • Page 9

    ... NXP Semiconductors 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 9. Package outline BAS16J (SOD323F/SC-90) 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 11. Package outline BAS16T (SOT416/SC-75) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 13 ...

  • Page 10

    ... NXP Semiconductors 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 15. Package outline BAS316 (SOD323/SC-76) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS16 SOT23 BAS16H SOD123F ...

  • Page 11

    ... NXP Semiconductors 11. Soldering 3 1.7 Fig 17. Reflow soldering footprint BAS16 (SOT23/TO-236AB) 4.6 2.6 Fig 18. Wave soldering footprint BAS16 (SOT23/TO-236AB) BAS16_SER_5 Product data sheet 3.3 2.9 1 2 1.4 2.8 4.5 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...

  • Page 12

    ... NXP Semiconductors Fig 19. Reflow soldering footprint BAS16H (SOD123F) 1.65 Fig 20. Reflow soldering footprint BAS16J (SOD323F) BAS16_SER_5 Product data sheet 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm 3.05 2.2 2.1 0.95 0 ...

  • Page 13

    ... NXP Semiconductors 0.9 Fig 21. Reflow soldering footprint BAS16L (SOD882) Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75) BAS16_SER_5 Product data sheet 1.3 0 Reflow soldering is the only recommended soldering method. 2.2 1.7 0.85 0 1.3 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes R0 ...

  • Page 14

    ... NXP Semiconductors 2 1.7 Fig 23. Reflow soldering footprint BAS16VV (SOT666) Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88) BAS16_SER_5 Product data sheet 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2 ) 1 Reflow soldering is the only recommended soldering method. 2.65 2.35 1.5 0.6 ...

  • Page 15

    ... NXP Semiconductors 4.5 Fig 25. Wave soldering footprint BAS16VY (SOT363/SC-88) Fig 26. Reflow soldering footprint BAS16W (SOT323/SC-70) BAS16_SER_5 Product data sheet 1.3 1.3 2.45 5.3 2.65 1.85 1.325 2 0 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.5 0.3 2.5 1 ...

  • Page 16

    ... NXP Semiconductors 3.65 2.1 Fig 27. Wave soldering footprint BAS16W (SOT323/SC-70) 1.65 Fig 28. Reflow soldering footprint BAS316 (SOD323/SC-76) BAS16_SER_5 Product data sheet 4.6 2.575 1.425 (3 ) 3.05 2.1 0.95 2 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.8 Dimensions in mm ...

  • Page 17

    ... NXP Semiconductors 2.75 Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76) Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79) BAS16_SER_5 Product data sheet 5 2 2.15 1.1 1 Reflow soldering is the only recommended soldering method. Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...

  • Page 18

    ... Release date BAS16_SER_5 20080825 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 5 “Marking • Table 6 “Limiting V • ...

  • Page 19

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 20

    ... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history ...