BAS16L,315 NXP Semiconductors, BAS16L,315 Datasheet - Page 14

DIODE SW 100V 215MA H-S SOD882

BAS16L,315

Manufacturer Part Number
BAS16L,315
Description
DIODE SW 100V 215MA H-S SOD882
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS16L,315

Package / Case
SOD-882
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
215mA (DC)
Current - Reverse Leakage @ Vr
500nA @ 80V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
1.5pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
215 mA
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
1 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4859-2
934057247315
BAS16L T/R
BAS16L T/R
BAS16L,315

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS16L,315
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 23. Reflow soldering footprint BAS16VV (SOT666)
Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88)
2
1.7
1.075
2.35
Reflow soldering is the only recommended soldering method.
0.538
1.5
(4 )
0.6
0.55
(2 )
(4 )
0.5
Rev. 05 — 25 August 2008
0.45
(4 )
(4 )
0.5
(4 )
(4 )
0.5
0.6
2.65
1.8
2.75
2.45
2.1
1.6
1.7
(2 )
0.6
0.65
(2 )
(2 )
0.6
0.4 (2 )
(6 )
0.4
0.325
0.25
(2 )
(4 )
High-speed switching diodes
0.375
BAS16 series
(2 )
(4 )
0.3
Dimensions in mm
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot363_fr
solder lands
placement area
solder paste
occupied area
sot666_fr
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