IRFR220,118 NXP Semiconductors, IRFR220,118 Datasheet

MOSFET N-CH 200V 4.8A SOT428

IRFR220,118

Manufacturer Part Number
IRFR220,118
Description
MOSFET N-CH 200V 4.8A SOT428
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet

Specifications of IRFR220,118

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
800 mOhm @ 2.9A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
4.8A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
14nC @ 10V
Input Capacitance (ciss) @ Vds
280pF @ 25V
Power - Max
42W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934056819118
IRFR220 /T3
IRFR220 /T3
1. Description
2. Features
3. Applications
4. Pinning information
Table 1:
[1]
1.
Pin
1
2
3
mb
It is not possible to make connection to pin 2 of the SOT428 package.
TrenchMOS is a trademark of Koninklijke Philips Electronics N.V.
Pinning - SOT428 (D-PAK), simplified outline and symbol
Description
gate (g)
drain (d)
source (s)
mounting base;
connected to drain (d)
M3D300
N-channel enhancement mode field-effect transistor in a plastic package using
TrenchMOS™
Product availability:
IRFR220 in SOT428 (D-PAK).
IRFR220
N-channel enhancement mode field effect transistor
Rev. 01 — 14 August 2001
Fast switching
Low on-state resistance
Surface mount package.
Switched mode power supplies
DC to DC converters.
[1]
Simplified outline
1
technology.
SOT428 (D-PAK)
Top view
1
mb
2
MBK091
3
Symbol
MBB076
g
d
s
Product data

Related parts for IRFR220,118

IRFR220,118 Summary of contents

Page 1

IRFR220 N-channel enhancement mode field effect transistor Rev. 01 — 14 August 2001 M3D300 1. Description N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS™ Product availability: IRFR220 in SOT428 (D-PAK). 2. Features Fast switching Low on-state resistance ...

Page 2

Philips Semiconductors 5. Quick reference data Table 2: Quick reference data Symbol Parameter V drain-source voltage (DC drain current (DC total power dissipation tot T junction temperature j R drain-source on-state resistance DSon 6. Limiting values ...

Page 3

Philips Semiconductors 120 P der (%) 100 100 P tot P = ---------------------- - 100% der P tot 25 C Fig 1. Normalized total power dissipation as a function of mounting ...

Page 4

Philips Semiconductors 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from junction to mounting th(j-mb) base 7.1 Transient thermal impedance Fig 4. Transient thermal impedance from junction to mounting base as a function of 9397 750 ...

Page 5

Philips Semiconductors 8. Characteristics Table 5: Characteristics unless otherwise specified j Symbol Parameter Static characteristics V drain-source breakdown voltage (BR)DSS V gate-source threshold voltage GS(th) I drain-source leakage current DSS I gate-source leakage current GSS R ...

Page 6

Philips Semiconductors ( Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values 4.5 R DSon ( ...

Page 7

Philips Semiconductors 5 V GS(th) (V) 4 max 3 typ min - mA Fig 9. Gate-source threshold voltage as a function of junction temperature ...

Page 8

Philips Semiconductors ( 150 0.2 0.4 0 and 150 Fig 12. Source (diode forward) current ...

Page 9

Philips Semiconductors 9. Package outline Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads (one lead cropped DIMENSIONS (mm are the original dimensions ...

Page 10

Philips Semiconductors 10. Revision history Table 6: Revision history Rev Date CPCN Description 01 20010814 - Product data; initial version 9397 750 08519 Product data N-channel enhancement mode field effect transistor Rev. 01 — 14 August 2001 IRFR220 © Koninklijke ...

Page 11

Philips Semiconductors Philips Semiconductors 11. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] ...

Page 12

Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...

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