MT18HVF25672PY-800E1 Micron Technology Inc, MT18HVF25672PY-800E1 Datasheet

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MT18HVF25672PY-800E1

Manufacturer Part Number
MT18HVF25672PY-800E1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT18HVF25672PY-800E1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240RDIMM
Device Core Size
72b
Organization
256Mx72
Total Density
2GByte
Chip Density
1Gb
Access Time (max)
40ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
2.88A
Number Of Elements
18
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Compliant
DDR2 VLP Registered DIMM (RDIMM)
MT18HVF12872(P) – 1GB
For component data sheets, refer to Micron's Web site:
Features
• Fits with ATCA form factor
• 240-pin, very low profile registered dual in-line
• Fast data transfer rates: PC2-3200, PC2-4200, or
• 1GB (128 Meg x 72)
• Supports ECC error detection and correction
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Single rank
• Multiple internal device banks for concurrent
• Programmable CAS# latency (CL)
• Posted CAS# additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8,192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• Gold edge contacts
Table 1:
PDF: 09005aef82255aba/Source: 09005aef81c753af
HVF18C128x72.fm - Rev. C 3/07 EN
memory module (VLP RDIMM)
PC2-5300
operation
Speed
Grade
DD
DDSPD
-667
-53E
-40E
= V
DD
= +1.7V to +3.6V
Q = +1.8V
Industry Nomenclature
Key Timing Parameters
PC2-5300
PC2-4200
PC2-3200
t
CK
CL = 5
667
1GB (x72, ECC, SR) 240-Pin DDR2 SDRAM VLP RDIMM
Data Rate (MT/s)
www.micron.com
CL = 4
533
533
400
1
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Parity
• Operating temperature
• Package
• Frequency/CAS latency
• PCB height
PCB height: 17.9mm (0.70in)
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
240-pin DIMM (Pb-free)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– 5.0ns @ CL = 3 (DDR2-400)
17.9mm (0.70in)
CL = 3
400
400
400
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. CL = CAS (READ) latency; registered mode
module offerings.
will add one clock cycle to CL.
240-Pin DIMM (ATCA Form Factor)
t
(ns)
RCD
15
15
15
A
A
1
2
≤ +85°C)
≤ +70°C)
©2003 Micron Technology, Inc. All rights reserved.
(ns)
t
15
15
15
RP
Marking
Features
None
-667
-53E
-40E
P
Y
I
(ns)
t
55
55
55
RC

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MT18HVF25672PY-800E1 Summary of contents

Page 1

... For component data sheets, refer to Micron's Web site: Features • Fits with ATCA form factor • 240-pin, very low profile registered dual in-line memory module (VLP RDIMM) • Fast data transfer rates: PC2-3200, PC2-4200, or PC2-5300 • 1GB (128 Meg x 72) • Supports ECC error detection and correction • ...

Page 2

... Refresh count Row address Device bank address Device page size per bank Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters 1GB Modules Base Device: MT47H128M4 2 Part Number MT18HVF12872(P)Y-667__ MT18HVF12872(P)Y-53E__ MT18HVF12872(P)Y-40E__ Notes: 1. Data sheets for the base devices can be found on Micron’s Web site. ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 240-Pin VLP RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 ...

Page 4

... Data input/output: Bidirectional data bus. (SSTL_18) CB0–CB7 I/O Check bits. (SSTL_18) SDA I/O Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect portion of the module Output Parity error found on the address and control bus (open drain) V ...

Page 5

Functional Block Diagram Figure 2: Functional Block Diagram V SS RS0# U16 S0# RS0#: DDR2 SDRAM R BA0–BA1 RBA0–RBA1: DDR2 SDRAM E A0–A13 RA0–RA13: DDR2 SDRAM G RAS# RRAS#: DDR2 SDRAM I CAS# RCAS#: DDR2 SDRAM S WE# RWE#: DDR2 ...

Page 6

... DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes can be programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...

Page 7

... Electrical Specifications Stresses greater than those listed in Table 6 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions above those indicated in each device's data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli- ability ...

Page 8

I Specifications DD Table 8: DDR2 I Specifications and Conditions – 1GB DD Values shown for MT47H128M4 DDR2 SDRAM only and are computed from values specified in the 512Mb (128 Meg x 4) component data sheet Parameter/Condition Operating one bank ...

Page 9

... Timing and switching specifications for the register listed above are critical for proper oper- ation of the DDR2 SDRAM registered DIMMs. These are meant subset of the param- eters for the specific device used on the module. Detailed information for this register is available in JEDEC Standard JESD82. ...

Page 10

Table 10: PLL Specifications CU877 device or equivalent JESD82-8.01 Parameter Symbol V DC high-level input voltage DC low-level input voltage V Input voltage (limits high-level input voltage low-level input voltage V Input differential-pair cross voltage ...

Page 11

Serial Presence-Detect Table 12: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input ...

Page 12

... Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on SDRAM 4 Number of column addresses on SDRAM 5 DIMM height and module ranks 6 Module data width 7 Reserved 8 Module voltage interface levels t 9 SDRAM cycle time, CK (CL = MAX value, see byte 18) ...

Page 13

... SPD revision 63 Checksum for bytes 0–62 ECC/ECC and parity 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 Identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99– ...

Page 14

... TYP TYP 63.0 (2.48) TYP 123.0 (4.84) TYP BACK VIEW U15 U17 U18 U16 70.68 (2.78) ® 14 Module Dimensions U9 U10 U11 18.05 (0.711) 17.75 (0.699) 10.0 (0.394) TYP PIN 120 55.0 (2.16) TYP U19 U20 U21 PIN 121 TYP Micron Technology, Inc ...

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