MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 1172

MC9S12XDP512CAL

Manufacturer Part Number
MC9S12XDP512CAL
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12XDP512CAL

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
91
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(16-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant

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Chapter 28 256 Kbyte Flash Module (S12XFTX256K2V1)
1174
Clock Register
Written
Check
Address, Data,
Access Error and
Protection Violation
Check
Simultaneous
Multiple Flash Block
Decision
Bit Polling for
Command Completion
Check
Command
Buffer Empty Check
Read: FCLKDIV register
Figure 28-26. Example Data Compress Command Flow
1.
2.
3.
yes
Data Compress Signature
Read: FDATA registers
Write: Flash Address to start
compression and number of word
addresses to compress
Write: FCMD register
Data Compress Command 0x06
Write: FSTAT register
Clear CBEIF 0x80
START
FDIVLD
Set?
Read: FSTAT register
Read: FSTAT register
MC9S12XDP512 Data Sheet, Rev. 2.21
yes
ACCERR/
Signature
no
yes
CBEIF
yes
no
Write: FCLKDIV register
Block?
CCIF
Set?
Set?
PVIOL
Set?
Flash
Next
Valid?
EXIT
no
yes
no
yes
no
no
Clear ACCERR/PVIOL 0x30
Write: FSTAT register
by 128K (skip unimplemented Flash)
Decrement Global Address
NOTE: FCLKDIV needs to
be set once after each reset.
Flash Sector(s) Compressed
NOTE: address used to select
Flash block; data ignored.
Erase and Reprogram
Freescale Semiconductor

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