MC9S12XDP512CAL Freescale, MC9S12XDP512CAL Datasheet - Page 1240

MC9S12XDP512CAL

Manufacturer Part Number
MC9S12XDP512CAL
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S12XDP512CAL

Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
91
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
2(16-chx10-bit)
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant

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Appendix A Electrical Characteristics
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
1242
Human Body
Latch-up
Num
1
2
3
4
Model
C
C
C
C
C
Series resistance
Storage capacitance
Number of pulse per pin
Minimum input voltage limit
Maximum input voltage limit
Human Body Model (HBM)
Charge Device Model (CDM)
Latch-up current at T
Latch-up current at T
Positive
Negative
Positive
Negative
Positive
Negative
Table A-3. ESD and Latch-Up Protection Characteristics
Table A-2. ESD and Latch-up Test Conditions
A
A
= 125 C
= 27 C
MC9S12XDP512 Data Sheet, Rev. 2.21
Rating
Description
Symbol
V
V
I
I
CDM
HBM
LAT
LAT
Symbol
+100
+200
2000
–100
–200
Min
500
R1
C
Freescale Semiconductor
Value
1500
–2.5
Max
100
7.5
3
3
Ohm
Unit
Unit
mA
mA
pF
V
V
V
V

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