ALXD800EEXJ2VD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD C3 Datasheet - Page 677

no-image

ALXD800EEXJ2VD C3

Manufacturer Part Number
ALXD800EEXJ2VD C3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of ALXD800EEXJ2VD C3

Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
ALX C
Appendix A: Support Documentation
A.1
Ordering information for the AMD Geode™ LX processors is contained in this section. The ordering part number (OPN) is
formed by a combination of elements. An example of the OPN is shown in Figure A-1. Valid OPN combinations are pro-
vided in Table A-1 on page 678.
AMD Geode™ LX Processors Data Book
Note:
Spaces are added to the ordering number shown above for viewing clarity only.
800
Order Information
EE
OPN (Note)
T
J
Appendix
Figure A-1. AMD Geode™ LX Processors OPN Example
C
V
C
Case Temperature:
Display Type: V = CRT, TFT, and VOP
Cache/EEPROM Indicator:
System Bus Speed:
Operating Voltage:
Package Type: EE = BGU (TE-PBGA)
Performance Indicator:
Maximum Thermal Design Power (MTDP):
Family/Architecture: ALX = AMD Geode™ LX Processor Family
Performance Indicator:
ASupport Documentation
T = 1.20V
X = 1.25V
Y = 1.40V
C = 0°C to 85°C Commercial
D = 0°C to 85°C Commercial Lead (Pb) Free
H = 0°C to 80°C Commercial Lead (Pb) Free
F = -40°C to 85°C Industrial Lead (Pb) Free
J = 400 MHz memory, GeodeLink™ Architecture (500/600 MHz CPU)
H = 333 MHz memory, GeodeLink™ Architecture (433 MHz CPU)
K = 266 MHz memory, GeodeLink™ Architecture (366 MHz CPU)
900 operates at 600 MHz
800 operates at 500 MHz
700 operates at 433 MHz
600 operates at 366 MHz
2 = 128K L2 cache, No EEPROM
C = 128K L2 cache, With EEPROM
C ≤ 3W
D ≤ 4W
G ≤ 6W
33234H
A
677

Related parts for ALXD800EEXJ2VD C3