ALXD800EEXJ2VD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD C3 Datasheet - Page 677
ALXD800EEXJ2VD C3
Manufacturer Part Number
ALXD800EEXJ2VD C3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.ALXD800EEXJ2VD_C3.pdf
(680 pages)
Specifications of ALXD800EEXJ2VD C3
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
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ALX C
Appendix A: Support Documentation
A.1
Ordering information for the AMD Geode™ LX processors is contained in this section. The ordering part number (OPN) is
formed by a combination of elements. An example of the OPN is shown in Figure A-1. Valid OPN combinations are pro-
vided in Table A-1 on page 678.
AMD Geode™ LX Processors Data Book
Note:
Spaces are added to the ordering number shown above for viewing clarity only.
800
Order Information
EE
OPN (Note)
T
J
Appendix
Figure A-1. AMD Geode™ LX Processors OPN Example
C
V
C
Case Temperature:
Display Type: V = CRT, TFT, and VOP
Cache/EEPROM Indicator:
System Bus Speed:
Operating Voltage:
Package Type: EE = BGU (TE-PBGA)
Performance Indicator:
Maximum Thermal Design Power (MTDP):
Family/Architecture: ALX = AMD Geode™ LX Processor Family
Performance Indicator:
ASupport Documentation
T = 1.20V
X = 1.25V
Y = 1.40V
C = 0°C to 85°C Commercial
D = 0°C to 85°C Commercial Lead (Pb) Free
H = 0°C to 80°C Commercial Lead (Pb) Free
F = -40°C to 85°C Industrial Lead (Pb) Free
J = 400 MHz memory, GeodeLink™ Architecture (500/600 MHz CPU)
H = 333 MHz memory, GeodeLink™ Architecture (433 MHz CPU)
K = 266 MHz memory, GeodeLink™ Architecture (366 MHz CPU)
900 operates at 600 MHz
800 operates at 500 MHz
700 operates at 433 MHz
600 operates at 366 MHz
2 = 128K L2 cache, No EEPROM
C = 128K L2 cache, With EEPROM
C ≤ 3W
D ≤ 4W
G ≤ 6W
33234H
A
677
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