ALXD800EEXJ2VD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD C3 Datasheet - Page 12

• Manufacturer Part Number: ALXD800EEXJ2VD C3
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VD C3

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

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General Features
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CPU Processor Features
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GeodeLink™ Control Processor
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*The AMD Geode LX 900@1.5W processor operates at 600 MHz, the AMD Geode LX 800@0.9W processor operates at 500 MHz, the
AMD Geode LX 700@0.8W processor operates at 433 MHz and the AMD Geode LX 600@.07W processor operates at 366 MHz. Model
numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark.
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Functional blocks include:
— CPU Core
— GeodeLink™ Control Processor
— GeodeLink Interface Units
— GeodeLink Memory Controller
— Graphics Processor
— Display Controller
— Video Processor
— Video Input Port
— GeodeLink PCI Bridge
— Security Block
0.13 micron process
Packaging:
— 481-Terminal BGU (Ball Grid Array Cavity Up) with
Single packaging option supports all features
Industrial temperature range available for the
LX 800@0.9W processor*
x86/x87-compatible CPU core
Performance:
— Processor frequency: up to 600 MHz
— Dhrystone 2.1 MIPs: 150 to 450
— Fully pipelined FPU
Split I/D cache/TLB (Translation Look-aside Buffer):
— 64 KB I-cache/64 KB D-cache
— 128 KB L2 cache configurable as I-cache, D-cache,
Efficient prefetch and branch prediction
Integrated FPU that supports the MMX™ and
AMD 3DNow!™ instruction sets
Fully pipelined single precision FPU hardware with
microcode support for higher precisions
JTAG interface:
— ATPG, Full Scan, BIST on all arrays
— 1149.1 Boundary Scan compliant
ICE (in-circuit emulator) interface
Reset and clock control
Designed for improved software debug methods and
performance analysis
– TFT Controller/Video Output Port
internal heatspreader
or both
Features
33234H
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GeodeLink™ Architecture
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GeodeLink™ Memory Controller
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2D Graphics Processor
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Power Management:
— LX 900@1.5W processor* (Unterminated):
— LX 800@0.9W processor* (Unterminated):
— LX 700@0.8W processor* (Unterminated):
— LX 600@0.7W processor* (Unterminated):
— GeodeLink active hardware power management
— Hardware support for standard ACPI software power
— I/O companion SUSP/SUSPA power controls
— Lower power I/O
— Wakeup on SMI/INTR
Works in conjunction with the AMD Geode™ CS5536
(USB 2.0) or CS5535 (USB 1.1) companion device
High bandwidth packetized uni-directional bus for
internal peripherals
Standardized protocol to allow variants of products to be
developed by adding or removing modules
GeodeLink Control Processor (GLCP) for diagnostics
and scan control
Dual GeodeLink Interface Units (GLIUs) for device inter-
connect
Integrated memory controller for low latency to CPU and
on-chip peripherals
64-bit wide DDR SDRAM bus operating frequency:
— 200 MHz, 400 MT/S
Supports unbuffered DDR DIMMS using up to 2 GB
DRAM technology
Supports up to 2 DIMMS (16 devices max)
High performance 2D graphics controller
Alpha BLT
Windows
— Hardware support for all Microsoft RDP codes
Command buffer interface for asynchronous BLTs
Second pattern channel support
Hardware screen rotation
Total Dissipated Power (TDP) 5.1W,
2.6W typical @ 600 MHz max power
Total Dissipated Power (TDP) 3.6W,
1.8W typical @ 500 MHz max power
Total Dissipated Power (TDP) 3.1W,
1.3W typical @ 433 MHz max power
Total Dissipated Power (TDP) 2.8W,
1.2W typical @ 366 MHz max power
management
®
GDI GUI acceleration:
AMD Geode™ LX Processors Data Book
Overview