BAP50-05 NXP Semiconductors, BAP50-05 Datasheet - Page 2

• Manufacturer Part Number: BAP50-05
• Description: Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50-05

• Configuration: Dual Common Cathode
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 250mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOT-23
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 3
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
FEATURES
 Two elements in common cathode configuration in a
 Low diode capacitance
 Low diode forward resistance.
APPLICATIONS
 General RF applications.
DESCRIPTION
Two planar PIN diodes in common cathode configuration
in a SOT23 small plastic SMD package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1999 May 10
Per diode
V
I
P
T
T
SYMBOL
F
small-sized plastic SMD package
stg
j
R
tot
General purpose PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
= 90 C
2
olumns
PINNING
CONDITIONS
Marking code: 1Cp.
Top view
Fig.1 Simplified outline (SOT23) and symbol.
2
PIN
1
2
3
3
1
anode
anode
common cathode



65
65
MIN.
Product specification
DESCRIPTION
2
50
50
250
+150
+150
BAP50-05
MAX.
3
V
mA
mW
C
C
MAM108
UNIT
1