BAP50-05 NXP Semiconductors, BAP50-05 Datasheet - Page 5

• Manufacturer Part Number: BAP50-05
• Description: Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50-05

• Configuration: Dual Common Cathode
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 250mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOT-23
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 3
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
PACKAGE OUTLINE
1999 May 10
General purpose PIN diode
Plastic surface-mounted package; 3 leads
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT23
1.1
0.9
A
max.
0.1
A
1
1
0.48
0.38
b
p
IEC
e 1
0.15
0.09
c
D
e
3.0
2.8
D
b p
3
TO-236AB
JEDEC
1.4
1.2
E
REFERENCES
0
2
1.9
e
w
B
0.95
M
e
1
JEITA
scale
B
1
5
2.5
2.1
H
E
0.45
0.15
L
p
A
2 mm
A 1
0.55
0.45
Q
H E
0.2
E
v
detail X
PROJECTION
0.1
EUROPEAN
w
L p
A
Q
c
Product specification
X
BAP50-05
v
ISSUE DATE
M
04-11-04
06-03-16
A
SOT23