BAP50-05 NXP Semiconductors, BAP50-05 Datasheet - Page 3

• Manufacturer Part Number: BAP50-05
• Description: Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50-05

• Configuration: Dual Common Cathode
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 250mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOT-23
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 3
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
1999 May 10
Per diode
V
V
I
C
r
R
j
SYMBOL
R
SYMBOL
D
= 25 C unless otherwise specified.
F
R
General purpose PIN diode
d
th j-s
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
thermal resistance from junction to soldering point
PARAMETER
PARAMETER
I
I
V
V
V
V
I
I
I
F
R
F
F
F
R
R
R
R
= 50 mA
= 0.5 mA; f = 100 MHz; note 1
= 1 mA; f = 100 MHz; note 1
= 10 mA; f = 100 MHz; note 1
= 10 A
= 50 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 5 V; f = 1 MHz
3
CONDITIONS

50







MIN.
0.95


0.45
0.35
0.3
25
14
3
TYP.
VALUE
220
Product specification
BAP50-05
1.1

100

0.6
0.5
40
25
5
MAX.
UNIT
K/W
V
V
nA
pF
pF
pF



UNIT