K4H561638H-ZPB3 Samsung Semiconductor, K4H561638H-ZPB3 Datasheet - Page 16

• Manufacturer Part Number: K4H561638H-ZPB3
• Manufacturer: Samsung Semiconductor

Specifications of K4H561638H-ZPB3

• Lead Free Status / Rohs Status: Compliant

19.0 AC Timming Parameters & Specifications
K4H561638H
Row cycle time
Refresh row cycle time
Row active time
RAS to CAS delay
Row precharge time
Row active to Row active delay
Write recovery time
Last data in to Read command
Clock cycle time
Clock high level width
Clock low level width
DQS-out access time from CK/CK
Output data access time from CK/CK
Data strobe edge to
ouput data edge
Read Preamble
Read Postamble
CK to valid DQS-in
DQS-in setup time
DQS-in hold time
DQS falling edge to CK rising-setup time
DQS falling edge from CK rising-hold time
DQS-in high level width
DQS-in low level width
Address and Control Input setup time(fast)
Address and Control Input hold time(fast)
Address and Control Input setup
Address and Control Input hold time(slow)
Data-out high impedence time from CK/CK
Data-out low impedence time from CK/CK
Mode register set cycle time
DQ & DM setup time to DQS
DQ & DM hold time to DQS
Control & Address input pulse width
DQ & DM input pulse width
Exit self refresh to non-Read command
Exit self refresh to read command
Refresh interval time
Output DQS valid window
Clock half period
Data hold skew factor
DQS write postamble time
Active to Read with Auto precharge
command
Autoprecharge write recovery +
Precharge time
Power Down Exit Time
Parameter
TSOP Package
FBGA Package
TSOP Package
FBGA Package
CL=2.0
CL=2.5
CL=3.0
tWPRES
tDQSCK
Symbol
tDQSQ
tDQSQ
tWPRE
tRPRE
tDQSS
tDQSH
tXSNR
tXSRD
tWPST
tRPST
tDQSL
tDIPW
tPDEX
tRCD
tRRD
tWTR
tMRD
tREFI
tQHS
tQHS
tRFC
tRAS
tDSS
tDSH
tRAP
tIPW
tDAL
tWR
tRC
tCH
tDS
tDH
tQH
tHP
tRP
tCK
tCL
tAC
tHZ
tLZ
tIS
tIH
tIS
tIH
or tCHmin
(tWR/tCK)
(tRP/tCK)
tCLmin
-0.55
-0.65
-0.65
-0.65
-tQHS
(DDR400@CL=3.0)
Min
0.45
0.45
0.72
0.25
0.35
0.35
1.75
200
0.9
0.4
0.2
0.2
0.6
0.6
0.7
0.7
0.4
0.4
2.2
tHP
0.4
55
70
40
15
15
10
15
10
75
15
2
6
5
0
+
-
-
-
-
1
CC
+0.55
+0.65
+0.65
+0.65
Max
0.55
0.55
1.28
70K
0.4
1.1
0.6
7.8
0.5
0.6
12
10
-
-
-
-
-
or tCHmin
(tWR/tCK)
(tRP/tCK)
tCLmin
(DDR333@CL=2.5)
-tQHS
Min
0.45
0.45
0.75
0.25
0.35
0.35
0.75
0.75
0.45
0.45
1.75
-0.6
-0.7
-0.7
-0.7
200
7.5
0.9
0.4
0.2
0.2
0.8
0.8
2.2
0.4
tHP
60
72
42
18
18
12
15
12
75
18
1
6
0
-
+
1
-
-
B3
Max
0.55
0.55
+0.6
+0.7
0.45
1.25
+0.7
+0.7
0.55
70K
0.4
1.1
0.6
7.8
0.5
0.6
12
12
-
-
-
Industrial
Rev. 1.3 February 2007
or tCHmin
(tWR/tCK)
(tRP/tCK)
tCLmin
(DDR266@CL=2.5)
-0.75
-0.75
-0.75
-0.75
-tQHS
Min
0.45
0.45
0.75
0.25
0.35
0.35
1.75
200
7.5
0.9
0.4
0.2
0.2
0.9
0.9
1.0
1.0
0.5
0.5
2.2
tHP
0.4
65
75
45
20
20
15
15
10
15
75
20
1
0
+
1
-
-
-
B0
DDR SDRAM
+0.75
+0.75
Max
+0.75
+0.75
0.55
0.55
1.25
0.75
0.75
70K
0.5
0.5
1.1
0.6
7.8
0.6
12
12
-
-
-
Unit
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
ns
ns
ns
15, 17~19
15, 17~19
16~19
16~19
20, 21
Note
j, k
j, k
22
13
18
18
14
21
21
12
23
11
11