FWIXP425BD Intel, FWIXP425BD Datasheet - Page 42

• Manufacturer Part Number: FWIXP425BD
• Description: IC NETWRK PROCESSR 533MHZ 492BGA
• Manufacturer: Intel

Specifications of FWIXP425BD

• Processor Type: Network
• Features: XScale Core
• Speed: 533MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 492-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 852279

Intel
Package and Pinout Information
4.0
4.1
Figure 6.
42
1. All measurements are in millimeters (mm).
2. The size of the land pad at the interposer side (1) is 0.81 mm.
3. The size of the solder resist at the interposer side (2) is 0.66 mm.
45º Chamfer
®
4 Places
IXP42X Product Line and IXC1100 Control Plane Processor
22.00 REF
Package and Pinout Information
The Intel
have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications
and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for
extended-temperature applications.
Package Description
492-Pin Lead PBGA Package
0.127 A
TOP VIEW
35.00 ± 0.20
30.00 ± 0.25
22.00 REF
Pin 1 ID
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
0.61 ± 0.06
2.38 ± 0.21
-A-
30.00 ± 0.25
0.60 ± 0.10
1.17 ± 0.05
35.00 ± 0.20
-B-
SIDE VIEW
ø
0.30
30º
S
3 Places
2
3
Seating Plane
C
1.63 REF
A
ø1.0
S
ø
B S
1.27
0.90
0.60
0.20
0.15
C
26
+
+
+
25
-C-
24
23
22
1.63 REF
21
20
19
18
17
16
15
14
(1)
13
12
1.27
11
10
9
8
7
6
+ +
5
4
3
2
1
Datasheet
AB
AC
AD
AA
AE
AF
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
B1268-03
Pin #1
Corner
(2)