LPC1833FET256,551 NXP Semiconductors, LPC1833FET256,551 Datasheet - Page 80

• Manufacturer Part Number: LPC1833FET256,551
• Description: Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1833FET256,551

• Core: ARM Cortex M3
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 136K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Details
• Other names: 935293791551

NXP Semiconductors
LPC1850_30_20_10
Objective data sheet
13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
x1
and C
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
x2
should be chosen smaller
x1
, C
x2
, and C
© NXP B.V. 2011. All rights reserved.
x3
in case of
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