MT48LC16M8A2TG-75 Micron Technology Inc, MT48LC16M8A2TG-75 Datasheet - Page 73

• Manufacturer Part Number: MT48LC16M8A2TG-75
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M8A2TG-75

• Organization: 16Mx8
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 150mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Figure 57:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60-Ball FBGA “FB/BB” Package (x8 device), 8mm x 16mm
60X Ø 0.45
8.00 ±0.05
Notes:
5.60
BALL
A8
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
0.155 ±0.013
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
73
SEATING PLANE
0.10 A
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
128Mb: x4, x8, x16 SDRAM
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID