NCP1910GEVB ON Semiconductor, NCP1910GEVB Datasheet - Page 37

• Manufacturer Part Number: NCP1910GEVB
• Description: BOARD EVAL NCP1910DEMO-B-TLS
• Manufacturer: ON Semiconductor
• Series: -r

Specifications of NCP1910GEVB

• Design Resources: NCP1910 Schematic NCP1910GEVB BOM
• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Power - Output: -
• Voltage - Output: Adj down to 0.8V
• Current - Output: 3A
• Voltage - Input: 3 ~ 5.5 V
• Regulator Topology: Buck
• Frequency - Switching: 1MHz
• Board Type: Fully Populated
• Utilized Ic / Part: NCP1910
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NCP1910GEVBOS

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0.10 C
0.33 C
PIN 1
A
NOTE 8
A1
D
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
24
1
NOTE 7
B
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
1
D
e
SOLDERING FOOTPRINT*
0.52
23X
NOTE 7
A
RECOMMENDED
NOTES 3 & 4
13
12
2X
0.25
C
E1
24X
SEATING
PLANE
0.20 C A-B
M
DIMENSIONS: MILLIMETERS
NOTES 5 & 6
b
PITCH
1.27
C
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.10 C D
SOIC−24 WB LESS PIN 21
A-B D
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
0.10 C
2X
http://onsemi.com
CASE 752AB−01
c
ISSUE O
1.62
23X
L2
11.00
37
DETAIL A
END VIEW
DETAIL A
h
x 45
NOTE 9
_
L
H
C
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION B DOES NOT INCLUDE DAMBAR
4. DIMENSIONS b AND c APPLY TO THE FLAT SEC-
5. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
6. DIMENSIONS D AND E1 ARE DETERMINED AT
7. DIMENSIONS A AND B ARE TO BE DETERMINED
8. A1 IS DEFINED AS THE VERTICAL DISTANCE
9. THIS CHAMFER IS OPTIONAL. IF IT IS NOT
Y14.5M, 1994.
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.10 mm TOTAL IN EXCESS OF ’b’ AT MAXIM-
UM MATERIAL CONDITION.
TION OF THE LEAD AND ARE MEASURED
BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
THE OUTERMOST EXTREMES OF THE PLASTIC
BODY EXCLUSIVE OF MOLD FLASH,
PROTRUSIONS, TIE BAR BURRS, OR GATE
BURRS BUT INCLUSIVE OF ANY MOLD
MISMATCH BETWEEN THE TOP AND BOTTOM OF
THE PLASTIC BODY.
AT DATUM H.
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
PRESENT, THEN A PIN 1 IDENTIFIER MUST BE
LOCATED IN THE INDICATED AREA.
DIM
A1
E1
L2
A
D
E
M
b
J
e
h
L
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
2.35
0.10
0.31
0.20
0.25
0.40
15.40 BSC
10.30 BSC
7.50 BSC
1.27 BSC
0.25 BSC
0
_
MAX
2.65
0.29
0.51
0.33
0.75
1.27
8
_
NCP1910/D