DS3172+ Maxim Integrated Products, DS3172+ Datasheet - Page 219

• Manufacturer Part Number: DS3172+
• Description: IC TXRX DS3/E3 DUAL 400-BGA
• Manufacturer: Maxim Integrated Products

Specifications of DS3172+

• Function: Single-Chip Transceiver
• Interface: DS3, E3
• Number Of Circuits: 2
• Voltage - Supply: 3.135 V ~ 3.465 V
• Current - Supply: 328mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Includes: DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -

16 PACKAGE THERMAL INFORMATION
The 36 thermal V
internal GND plane of the PC board to achieve these thermal characteristics.
Target Ambient Temperature Range
Die Junction Temperature Range
Theta-JA, Still Air
Note 1:
Theta-JA is based on the package mounted on a 4-layer JEDEC board
and measured in a JEDEC test chamber.
PARAMETER
SS
balls in the center 6X6 matrix must be thermally and electrically connected to the
12.6 °C/W (Note 1)
-40°C to +85°C
-40 to +125°C
VALUE
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