DS3172+ Maxim Integrated Products, DS3172+ Datasheet - Page 50

• Manufacturer Part Number: DS3172+
• Description: IC TXRX DS3/E3 DUAL 400-BGA
• Manufacturer: Maxim Integrated Products

Specifications of DS3172+

• Function: Single-Chip Transceiver
• Interface: DS3, E3
• Number Of Circuits: 2
• Voltage - Supply: 3.135 V ~ 3.465 V
• Current - Supply: 328mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA
• Includes: DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -

10 FUNCTIONAL DESCRIPTION
10.1 Processor Bus Interface
10.1.1 8/16 Bit Bus Widths
The external processor bus can be sized for 8 or 16 bits using the WIDTH pin. When in 8-bit mode (WIDTH=0), the
address is composed of all the address bits including A[0], the lower 8 data lines D[7:0] are used and the upper 8
data lines D[15:8] are not used and never driven during a read cycle. When in 16-bit mode (WIDTH=1), the
address bus does not include A[0] (the LSB of the address bus is not routed to the chip) and all 16 data lines
D[15:0] are used. See
10.1.2 Ready Signal (RDY)
The RDY signal allows the microprocessor to use the minimum bus cycle period for maximum efficiency. When this
signal goes low, the RD or WR cycle can be terminated. See
NOTE: The RDY signal will not go active if the user attempts to read or write unused ports or unused registers not
assigned to any design blocks. The RDY signal will go active if the user writes or reads reserved registers or
unused registers within design blocks.
10.1.3 Byte Swap Modes
The processor interface can operate in byte swap mode when the data bus is configured for 16-bit operation. The
A[0]/BSWAP pin is used to determine whether byte swapping is enabled. This pin should be static and not change
while operating. When the A[0]/BSWAP pin is low the upper register bits REG[15:8] are mapped to the upper
external data bus lines D[15:8], and the lower register bits REG[7:0] are mapped to the lower external data bus
lines D[7:0]. When the A[0]/BSWAP pin is high the upper register bits REG[15:8] are mapped to the lower external
data bus lines D[7:0], and the lower register bits REG[7:0] are mapped to the upper external data bus lines D[15:8].
See
10.1.4 Read-Write / Data Strobe Modes
The processor interface can operate in either read-write strobe mode or data strobe mode. When MODE=0 the
read-write strobe mode is enabled and a negative pulse on RD performs a read cycle, and a negative pulse on WR
performs a write cycle. When MODE=1 the data strobe mode is enabled and a negative pulse on DS when R/W is
high performs a read cycle, and a negative pulse on DS when R/W is low performs a write cycle. The read-write
strobe mode is commonly called the “Intel” mode, and the data strobe mode is commonly called the “Motorola”
mode.
10.1.5 Clear on Read / Clear on Write Modes
The latched status register bits can be programmed to clear on a read access or clear on a write access. The
global control register bit GL.CR1.LSBCRE controls the mode that all of the latched registers are cleared. When
LSBCRE=0, the latched register bits will be cleared when the register is written to and the write data has the
register bits to clear set. When LSBCRE=1, the latched register bits that are set will be cleared when the register is
read.
The clear on write mode expects the user to use the following protocol:
This protocol is useful when multiple uncoordinated software tasks access the same latched register. Each task
should only clear the bits with which it is concerned; the other tasks will clear the bits with which they are
concerned.
Figure 8-23
and
Figure 8-24
Figure 8-19
1. Read the latched status register
2. Write to the registers with the bits set that need to be cleared.
for functional timing diagrams.
and
Figure 8-21
for functional timing diagrams.
50
Figure 8-27
for functional timing diagrams.