AD9644 Analog Devices, AD9644 Datasheet - Page 10

• Manufacturer Part Number: AD9644
• Description: 14-Bit, 80 MSPS/155 MSPS, 1.8V Dual, Serial Output A/D Converter
• Manufacturer: Analog Devices

Specifications of AD9644

• Resolution (bits): 14bit
• # Chan: 2
• Sample Rate: 155MSPS
• Analog Input Type: Diff-Bip
• Ain Range: 1.75 V p-p
• Adc Architecture: Pipelined

AD9644
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
ELECTRICAL
ENVIRONMENTAL
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DRVDD to AGND
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VCMA, VCMB to AGND
CSB to AGND
SCLK to AGND
SDIO to AGND
PDWN to AGND
DOUT+A, DOUT0−A, DOUT0+B,
DSYNC+A, DSYNC−A, DSYNC+B,
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
DOUT−B to AGND
DSYNC−B to AGND
(Ambient)
Under Bias
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. C | Page 10 of 44
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Package Type
48-Lead LFCSP
7 mm × 7 mm
(CP-48-8)
1
2
3
4
Typical θ
plane. As shown Table 7, airflow improves heat dissipation,
which reduces θ
package leads from metal traces, through holes, ground, and
power planes, reduces θ
ESD CAUTION
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-STD 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
JA
is specified for a 4-layer PCB with a solid ground
JA
. In addition, metal in direct contact with the
Airflow
Velocity
(m/sec)
0
1.0
2.5
JA
.
θ
25
22
20
JA
1, 2
θ
2
JC
1, 3
Data Sheet
θ
14
JB
1, 4
Unit
°C/W
°C/W
°C/W