STM8L152C8 STMicroelectronics, STM8L152C8 Datasheet - Page 123

• Manufacturer Part Number: STM8L152C8
• Description: STM8L-Ultra Low Power-8 bits Microcontrollers
• Manufacturer: STMicroelectronics

Specifications of STM8L152C8

• Operating Power Supply: 1.65 to 3.6 V (without BOR), 1.8 to 3.6 V (with BOR)
• Temp. Range: −40 to 85, 105 or 125 °C
• 5 Low Power Modes: Wait, Low power run (5.9 μA), Low power wait (3 μA), Active-halt with full RTC (1.4 μA), Halt (400 nA)
• Dynamic Power Consumption: 200 μA/MHz+330 μA
• Ultra Low Leakage Per I/0: 50 nA
• Max Freq: 16 MHz, 16 CISC MIPS peak
• Lcd: 8x40 or 4x44 w/ step-up converter

STM8L15xx8, STM8L15xR6
Table 65.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 51. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
Symbol
back-side pad to PCB ground.
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
outline
0.550
0.020
0.530
0.150
0.230
7.000
4.700
7.000
4.700
0.500
0.400
Typ
(1)(2)(3)
millimeters
0.500
0.500
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.140
0.080
Min
0
Doc ID 17943 Rev 4
0.600
0.050
0.550
0.160
0.300
7.150
5.250
7.150
5.250
0.550
0.500
Max
Figure 52. Recommended footprint
0.02170
0.0008
0.0209
0.0059
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
7.30
Typ
0.30
0.55
0.20
12
1
48
13
(dimensions in mm)
inches
6.20
0.01970
0.0197
0.0055
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
0.0031
Package characteristics
Min
0
7.30
5.60
5.80
6.20
(1)
5.60
0.50
37
24
0.0236
0.0020
0.0217
0.0063
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
36
25
Max
(1)
0.75
123/126
5.80
ai15697