74HC367DB,112 NXP Semiconductors, 74HC367DB,112 Datasheet

IC BUFF DVR TRI-ST HEX 16SSOP

74HC367DB,112

Manufacturer Part Number
74HC367DB,112
Description
IC BUFF DVR TRI-ST HEX 16SSOP
Manufacturer
NXP Semiconductors
Series
74HCr

Specifications of 74HC367DB,112

Package / Case
16-SSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
2, 4 (Hex)
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74HC
Number Of Channels Per Chip
6
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 7.8 mA
Input Bias Current (max)
8 uA
Low Level Output Current
7.8 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
8 ns
Number Of Lines (input / Output)
6 / 6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2668-5
935188700112
INTEGRATED CIRCUITS
DATA SHEET
Package outline drawings
January 1996
File under Integrated Circuits, IC06

Related parts for 74HC367DB,112

74HC367DB,112 Summary of contents

Page 1

DATA SHEET Package outline drawings File under Integrated Circuits, IC06 INTEGRATED CIRCUITS January 1996 ...

Page 2

Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DIP SOT27-1 plastic dual in-line package; 14 leads (300 mil) SOT38-4 plastic dual in-line package; 16 leads (300 mil) SOT146-1 plastic dual in-line package; 20 leads (300 mil) SOT101-1 plastic dual in-line ...

Page 3

Philips Semiconductors Package outline drawings DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

Page 4

Philips Semiconductors Package outline drawings DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 5

Philips Semiconductors Package outline drawings DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 6

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 7

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (300 mil pin 1 index 1 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions UNIT b max. min. ...

Page 8

Philips Semiconductors Package outline drawings DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT ...

Page 9

Philips Semiconductors Package outline drawings SO SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

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Philips Semiconductors Package outline drawings SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 11

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 12

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 13

Philips Semiconductors Package outline drawings SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 14

Philips Semiconductors Package outline drawings SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 15

Philips Semiconductors Package outline drawings SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 16

Philips Semiconductors Package outline drawings SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 17

Philips Semiconductors Package outline drawings SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 18

Philips Semiconductors Package outline drawings SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 19

Philips Semiconductors Package outline drawings SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 20

Philips Semiconductors Package outline drawings TSSOP TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 21

Philips Semiconductors Package outline drawings TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 22

Philips Semiconductors Package outline drawings TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 23

Philips Semiconductors Package outline drawings TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

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