74HC367DB,112 NXP Semiconductors, 74HC367DB,112 Datasheet - Page 3

• Manufacturer Part Number: 74HC367DB,112
• Description: IC BUFF DVR TRI-ST HEX 16SSOP
• Manufacturer: NXP Semiconductors
• Series: 74HCr

Specifications of 74HC367DB,112

• Package / Case: 16-SSOP
• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 2, 4 (Hex)
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: 74HC
• Number Of Channels Per Chip: 6
• Polarity: Non-Inverting
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 7.8 mA
• Input Bias Current (max): 8 uA
• Low Level Output Current: 7.8 mA
• Minimum Operating Temperature: - 40 C
• Output Type: 3-State
• Propagation Delay Time: 8 ns
• Number Of Lines (input / Output): 6 / 6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2668-5; 935188700112

Philips Semiconductors
DIP
DIP14: plastic dual in-line package; 14 leads (300 mil)
January 1996
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Package outline drawings
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT27-1
max.
0.17
4.2
A
L
0.020
min.
0.51
A
Z
1
14
pin 1 index
1
050G04
IEC
max.
0.13
3.2
A
2
e
0.068
0.044
1.73
1.13
b
MO-001AA
0.021
0.015
0.53
0.38
JEDEC
b
D
1
REFERENCES
0
0.014
0.009
0.36
0.23
b
c
19.50
18.55
0.77
0.73
D
(1)
scale
EIAJ
5
3
b
8
7
1
6.48
6.20
0.26
0.24
E
(1)
A
w
1
M
2.54
0.10
e
A
E
10 mm
2
A
7.62
0.30
e
1
3.60
3.05
0.14
0.12
L
c
PROJECTION
EUROPEAN
8.25
7.80
0.32
0.31
M
(e )
M
M
E
H
1
E
10.0
0.39
0.33
M
8.3
H
ISSUE DATE
0.254
0.01
92-11-17
95-03-11
w
SOT27-1
0.087
max.
2.2
Z
(1)