74HC367DB,112 NXP Semiconductors, 74HC367DB,112 Datasheet - Page 11

IC BUFF DVR TRI-ST HEX 16SSOP

74HC367DB,112

Manufacturer Part Number
74HC367DB,112
Description
IC BUFF DVR TRI-ST HEX 16SSOP
Manufacturer
NXP Semiconductors
Series
74HCr

Specifications of 74HC367DB,112

Package / Case
16-SSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
2, 4 (Hex)
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74HC
Number Of Channels Per Chip
6
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 7.8 mA
Input Bias Current (max)
8 uA
Low Level Output Current
7.8 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
8 ns
Number Of Lines (input / Output)
6 / 6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2668-5
935188700112
Philips Semiconductors
SO16: plastic small outline package; 16 leads; body width 3.9 mm
January 1996
Package outline drawings
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT109-1
0.069
max.
1.75
A
16
1
0.010
0.004
Z
0.25
0.10
pin 1 index
A
1
y
0.057
0.049
1.45
1.25
A
076E07S
2
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
p
D
MS-012AC
0.0100
0.0075
0.25
0.19
JEDEC
c
REFERENCES
10.0
0.39
0.38
D
9.8
0
(1)
0.16
0.15
E
4.0
3.8
(1)
b
scale
p
0.050
EIAJ
2.5
1.27
11
9
8
e
w
0.244
0.228
H
6.2
5.8
M
c
E
0.041
5 mm
A
1.05
2
L
A
1
0.039
0.016
1.0
0.4
L
p
0.028
0.020
H
0.7
0.6
E
Q
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
L
v
L
p
Q
0.25
0.01
(A )
w
3
A
0.004
0.1
y
A
X
v
ISSUE DATE
95-01-23
97-05-22
M
0.028
0.012
Z
0.7
0.3
(1)
A
SOT109-1
8
0
o
o

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