74HC367DB,112 NXP Semiconductors, 74HC367DB,112 Datasheet - Page 21

• Manufacturer Part Number: 74HC367DB,112
• Description: IC BUFF DVR TRI-ST HEX 16SSOP
• Manufacturer: NXP Semiconductors
• Series: 74HCr

Specifications of 74HC367DB,112

• Package / Case: 16-SSOP
• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 2, 4 (Hex)
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: 74HC
• Number Of Channels Per Chip: 6
• Polarity: Non-Inverting
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 7.8 mA
• Input Bias Current (max): 8 uA
• Low Level Output Current: 7.8 mA
• Minimum Operating Temperature: - 40 C
• Output Type: 3-State
• Propagation Delay Time: 8 ns
• Number Of Lines (input / Output): 6 / 6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2668-5; 935188700112

Philips Semiconductors
January 1996
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Package outline drawings
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.10
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
(1)
w
E
4.5
4.3
M
(2)
scale
EIAJ
2.5
0.65
21
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
1.0
L
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
v
0.1
A
y
M
ISSUE DATE
A
94-07-12
95-04-04
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o