CD4017BMS Intersil Corporation, CD4017BMS Datasheet - Page 10

• Manufacturer Part Number: CD4017BMS
• Description: CMOS Counter/Dividers
• Manufacturer: Intersil Corporation

Chip Dimensions and Pad Layouts
10
METALLIZATION: Thickness: 11k
PASSIVATION: 10.4kÅ - 15.6k
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10
CD4017BMS, CD4022BMS
CD4017BMSH
CD4022BMSH
Å
, Silane
Å
14k
Å, AL.
-3
inch)