upd72872 Renesas Electronics Corporation., upd72872 Datasheet - Page 36

• Manufacturer Part Number: upd72872
• Description: Ieee1394 1-chip Ohci Host Controller
• Manufacturer: Renesas Electronics Corporation.

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7. RECOMMENDED SOLDERING CONDITIONS
Technology Manual (C10535E).
representative.
µ µ µ µ PD72872GC-9EV: 120-pin plastic TQFP (Fine pitch) (14 x 14)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
36
Infrared reflow
Partial heating
The µ PD72850A should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
For soldering methods and conditions other than those recommended below, contact your NEC sales
Soldering
Method
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).
Count: three times or less
Exposure limit: 3 days
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
Table 7-1. Surface Mounting Type Soldering Conditions
Note
(after that prebake at 125°C for 10 hours)
Data Sheet S14793EJ1V0DS
Soldering Conditions
Condition Symbol
Recommended
IR35-103-3
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