w9425g6jb Winbond Electronics Corp America, w9425g6jb Datasheet - Page 30

• Manufacturer Part Number: w9425g6jb
• Manufacturer: Winbond Electronics Corp America

10.6 System Notes:
a. Pullup slew rate is characterized under the test conditions as shown in Figure 1.
b. Pulldown slew rate is measured under the test conditions shown in Figure 2.
c. Pullup slew rate is measured between (V
d. Evaluation conditions
e. Verified under typical conditions for qualification purposes.
f. TSOP II package devices only.
Pulldown slew rate is measured between (V
Pullup and Pulldown slew rate conditions are to be met for any pattern of data, including all outputs
switching and only one output switching.
Example: For typical slew rate, DQ0 is switching
Typical:
Minimum:
Maximum:
For minimum slew rate, all DQ bits are switching worst case pattern
For maximum slew rate, only one DQ is switching from either high to low, or low to high
The remaining DQ bits remain the same as for previous state
25
70
0
o
C (T Ambient), V
o
o
C (T Ambient), V
C (T Ambient), V
Output
Output
Figure 1: Pullup slew rate test load
Figure 2: Pulldown slew rate test load
DDQ
DDQ
DDQ
= maximum, fast-fast process
= nominal, typical process
= minimum, slow-slow process
VSSQ
DDQ
VDDQ
DDQ
/2 - 320 mV ± 250 mV)
- 30 -
50 Ω
/2 + 320 mV ± 250 mV)
50 Ω
Test point
Test point
Publication Release Date: Oct. 08, 2010
W9425G6JB
Revision A01