tza3013bu-n3 NXP Semiconductors, tza3013bu-n3 Datasheet - Page 15

• Manufacturer Part Number: tza3013bu-n3
• Description: Sdh/sonet Stm16/oc48 Transimpedance Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
Short-form specification
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
2001 Feb 26
Objective specification
Preliminary specification
Product specification
DATA SHEET STATUS
SDH/SONET STM16/OC48
transimpedance amplifier
Development
Qualification
Production
Applications that are
The data in a short-form
PRODUCT
Limiting values given are in
These products are not
STATUS
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
15
Right to make changes
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all
data sheet limits up to the point of wafer sawing for a
period of ninety (90) days from the date of Philips' delivery.
If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There is no post
waffle pack testing performed on individual die. Although
the most modern processes are utilized for wafer sawing
and die pick and place into waffle pack carriers, Philips
Semiconductors has no control of third party procedures in
the handling, packing or assembly of the die. Accordingly,
Philips Semiconductors assumes no liability for device
functionality or performance of the die or systems after
handling, packing or assembly of the die. It is the
responsibility of the customer to test and qualify their
application in which the die is used.
DEFINITIONS
TZA3013A; TZA3013B
(1)
Philips Semiconductors
Product specification