tza3036u-t-n1 NXP Semiconductors, tza3036u-t-n1 Datasheet - Page 3

• Manufacturer Part Number: tza3036u-t-n1
• Description: Sdh/sonet Stm1/oc3 Transimpedance Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
6. Pinning information
Table 2.
Bonding pad locations with respect to the center of the die (see
TZA3036_1
Product data sheet
Symbol
DREF
IPHOTO
DREF
V
IDREF_MON
AGC
OUTQ
OUT
GND
GND
CC
Bonding pad description
Pad
1
2
3
4
5
6
7
8
9
10
6.1 Pinning
6.2 Pin description
Fig 2. Pin configuration
X
66.4
206.4
346.4
486.4
493.6
493.6
493.6
353.6
213.6
73.6
Y
140
0
140
278.6
278.6
278.6
278.6
278.6
278.6
278.6
IDREF_MON
Rev. 01 — 24 March 2006
OUTQ
GND
GND
AGC
OUT
V
Type
output
input
output
supply
output
input
output
output
ground
ground
CC
10
4
5
6
7
9
8
Figure
SDH/SONET STM1/OC3 transimpedance amplifier
3
Description
bias voltage output for PIN diode; connect cathode of
PIN diode to pad 1 or pad 3
current input; anode of PIN diode should be connected
to this pad
bias voltage output for PIN diode; connect cathode of
PIN diode to pad 1 or pad 3
supply voltage; connect supply to pad 4 or pad 17
current output for RSSI measurements; connect a
resistor to pad 5 or pad 16 and ground
AGC voltage; use pad 6 or pad 15
data output; complement of pad OUT; use pad 7 or pad
13
data output; use pad 8 or pad 14
ground; connect together pads 9, 10, 11 and 12 as
many as possible
ground; connect together pads 9, 10, 11 and 12 as
many as possible
TZA3036
10); X and Y are in m.
2
1
001aad076
17
16
15
14
13
12
11
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
V
IDREF_MON
AGC
OUT
OUTQ
GND
GND
CC
[1]
TZA3036
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