tza3036u-t-n1 NXP Semiconductors, tza3036u-t-n1 Datasheet - Page 7

• Manufacturer Part Number: tza3036u-t-n1
• Description: Sdh/sonet Stm1/oc3 Transimpedance Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
TZA3036_1
Product data sheet
7.3 Monitoring RSSI via IDREF_MON
For applications where the transimpedance is controlled by the TIA it is advised to leave
the AGC pads unconnected to achieve fast attack and decay times.
The AGC function can be overruled by applying a voltage to pad AGC. In this
configuration, connecting pad AGC to ground gives maximum transimpedance and
connecting it to V
AGC voltage should be derived from the V
For maximum freedom on bonding location, 2 pads are available for AGC (pads 6 and 15).
These pads are internally connected. Both pads can be used if necessary.
To facilitate RSSI monitoring in modules (e.g. SFF-8472 compliant SFP modules), a
current output is provided. This output gives a current which is 20 % of the average DREF
current through the 290
output, a voltage proportional with to average input power can be obtained.
The RSSI monitoring is implemented by measuring the voltage over the 290
resistor. This method is preferred over a simple current mirror because at small photo
currents the voltage drop over the resistor is very small. This gives a higher bias voltage
yielding better performance of the photodiode.
For maximum freedom on bonding location, 2 pads are available for IDREF_MON (pads 5
and 16). These pads are internally connected. Both pads can be used if necessary. If only
one is used, the other can be left open.
Fig 7. Transimpedance as function of the AGC voltage
CC
transimpedance
gives minimum transimpedance. This is depicted in
10
Rev. 01 — 24 March 2006
(k )
10
10
1
2
1
0.2
bias resistor. By connecting a resistor to the IDREF_MON
0.4
SDH/SONET STM1/OC3 transimpedance amplifier
CC
0.6
for proper functioning.
0.8
V
AGC
001aad081
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
/V
CC
1.0
TZA3036
Figure
bias
7. The
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