hys64t128020emv-2.5c2

Manufacturer Part Numberhys64t128020emv-2.5c2
Description214-pin 1.5v Unbuffered Ddr2 Sdram Microdimm Modules Mdimm Sdram
ManufacturerQimonda
hys64t128020emv-2.5c2 datasheet
 
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June 2008
H Y S 6 4 T 1 2 8 0 2 0 E M V – 2 . 5 C 2
H Y S6 4 T 12 80 20 E MV– 3 S– C 2
2 1 4 - P i n 1 . 5 V U n b u f f e r e d D D R 2 S D R A M Mi c r o D I M M
M o d u l e s
M D I M M S D R A M
E U R o H S C o m p l i a n t
I n t e r n e t D a t a S h e e t
Rev. 1.00

hys64t128020emv-2.5c2 Summary of contents

  • Page 1

    – MV– 3 S– ...

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    ... HYS64T128020EMV–2.5C2, HYS64T128020EMV–3S–C2 Revision History: 2008-06, Rev. 1.00 Page Subjects (major changes since last revision) All Final data sheet and adapted to internet edition. Previous Revision: 2008-01, Rev. 0.50 All New Document We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document ...

  • Page 3

    ... For more information please visit www.qimonda.com/green_products . Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules • Auto Refresh for temperatures above 85 °C • Programmable self refresh rate via EMRS2 setting. • Programmable partial array refresh via EMRS2 settings. ...

  • Page 4

    ... Product Type Compliance Code PC2-6400 (6-6-6) HYS64T128020EMV-2.5C2 1GB 2R×16 PC2–6400M–666–12–A0 PC2-5300 (5-5-5) HYS64T128020EMV-3S-C2 1GB 2R×16 PC2–5300M–555–12–A0 1) For detailed information regarding Product Type of Qimonda please see chapter "Product Type Nomenclature" of this data sheet. ...

  • Page 5

    ... DRAM Components HYS64T128020EMV HYB15T1G160C2F 1) Green Product 2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules Components on Modules 1) DRAM Density DRAM Organisation 64M × 16 1Gbit ...

  • Page 6

    ... Rank 0 is selected by S0; Rank 1 is selected by S1. 2. 2-rank module Not Connected Note: 1-rank module 6 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 (214 pins). The abbreviations used in Figure 1. TABLE 5 Pin Configuration of MDIMM ...

  • Page 7

    ... Address Input 13 × Note: Modules based on 4/ – Not Connected × Note: Modules based on 16 component SSTL Data Bus 63:0 Note: Data Input / Output pins SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL 7 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 × 8 component ...

  • Page 8

    ... SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL 8 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 ...

  • Page 9

    ... DM operates as a byte mask by allowing input data to be SSTL written LOW but blocks the write operation HIGH. In SSTL Read mode, DM lines have no effect. SSTL SSTL SSTL SSTL 9 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 and DDR2 SDRAM mode registers SS ...

  • Page 10

    ... Note: Serial EEPROM positive power supply, wired to a separate power pin at the connector which supports from 1.45 Volt to 3.6 Volt. – Ground Plane Note: Power and ground for the DDR2 SDRAM, DRAM’s are DDR2 components and EEPROM are also connected to GND. 10 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 V DDSPD ...

  • Page 11

    ... Asserts on-die termination for DQ, DM, DQS, and DQS\signals if enabled via the DDR2 SDRAM mode register. 2. 2-rank module Not Connected Note: 1-rank module Not connected Note: Pins not connected on Qimonda MDIMMs 11 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 TABLE 6 Abbreviations for Pin Type TABLE 7 Abbreviations for Buffer Type ...

  • Page 12

    ... Pin Configuration for Two-Piece Mezzanine Socket on MDIMM (214 pins) Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules 12 Internet Data Sheet FIGURE 1 ...

  • Page 13

    ... Operating Humidity (relative) Storage Humidity (without condensation) 1) Storage Temperature is the case surface temperature on the center/top side of the DRAM 3000 m. Symbol Parameter T Operating Temperature CASE Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules Rating Min. V –1 –0 – ...

  • Page 14

    ... SSQ PEAK – 5 — (DC). is also expected to track noise in REF REF ≤ 0.3 V; all other pins Current is per pin IN DDQ 14 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–) approximately 50% DD6 TABLE 11 Unit Note Max. 1 1.9 V 0.51 × DDQ 3 ...

  • Page 15

    ... RAS t 60 — — RCD t 15 — stabilizes. During the period before REF REF Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 TABLE 12 Speed Grade Definition Unit Note t CK — 1)2)3)4) ns 1)2)3)4) ns 1)2)3)4) ns 1)2)3)4) ns 1)2)3)4)5) ns 1)2)3)4) ns 1)2)3)4) ns 1)2)3)4) ns TABLE 13 Speed Grade Definition ...

  • Page 16

    ... Min( HP CH.ABS CL.ABS t t — — HZ AC.MAX t 250 — 275 IH.BASE t 0.6 — 0.6 IPW t 175 — 200 IS.BASE 16 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 TABLE 14 Unit Note )4)5)6)7) Min. Max. 8) +450 ps — nCK 9)10) t 0.52 CK.AVG 8000 ps 11) — nCK 9)10) 0.52 t CK.AVG 12)13) t — nCK nRP + – ...

  • Page 17

    ... XSNR RFC t 200 — 200 XSRD WL RL – 1 RL–1 V stabilizes. During the period before REF REF Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 Unit Note )4)5)6)7) Min. Max. 8)21 AC.MIN AC.MAX 8)21 AC.MIN AC.MAX 34 — nCK 34) 12 ...

  • Page 18

    ... IH.AC t value is; and the larger the valid data eye will be 1080 ps minimum Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 t ‘ represents the actual of the input clock CK.AVG t of the input clock. (output ERR(6-10per – 272 ERR(6-10PER).MIN = – ...

  • Page 19

    ... In “low active power-down mode” (MR, A12 =”1”) a slow XARD t timing parameter, where For each of the terms, if not already an integer, round to the next highest integer Internet Data Sheet HYS64T128020EMV–[2.5/3S](–) begins RPST t of the input clock. (output JIT.PER t = – JIT.PER.MIN RPRE ...

  • Page 20

    ... Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules Method for Calculating Transitions and Endpoint Differential Input Waveform Timing 20 Internet Data Sheet FIGURE 2 FIGURE and DS DH ...

  • Page 21

    ... Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules Differential Input Waveform Timing 21 Internet Data Sheet FIGURE and lS lH ...

  • Page 22

    ... CK.AVG means; if Power Down exit is registered CK.AVG ERR.2PER(Min which is interpreted differently per speed bin. For DDR2-667/800 AOND 22 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 TABLE 15 Unit Note 1) AC.MAX 1) ...

  • Page 23

    ... MIN CK CK.MIN interval, CKE is HIGH HIGH between valid RFC RFC.MIN = t interval, CKE is LOW and CS is HIGH between valid RFC REFI 23 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 TABLE 16 I Measurement Conditions DD Symbol Note 3)4)5) I DD0 6) I DD1 , RAS RAS.MIN ...

  • Page 24

    ... ODT disabled current mode. The other rank mA). To achieve this on module level the output OUT ≥ IH(ac).MIN /2 24 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 1)2) Symbol Note 3)4)5) I DD6 6) I DD7 I Precharge Power-Down DD2P TABLE 17 I Definitions for DD ...

  • Page 25

    ... DD4W I 964 DD5B I 128 DD5D I 56 DD6 I 1360 DD7 Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules I Specification at 1.8V for HYS64T128020EMV-[2.5/3S](-) Ranks (×16) ×64 –3S Max. 452 488 432 104 416 496 320 160 672 720 948 ...

  • Page 26

    ... DDX (rank) 5) Fast: MRS(12)=0 6) Slow: MRS(12)=1 values are for 0°C ≤ and DD5D DD6 Case Rev. 1.00, 2008-06 01242008-CDK4-KSK6 Unbuffered DDR2 SDRAM MicroDIMM Modules I Specification at 1.5V for HYS64T128020EMV-[2.5/3S](-) Ranks (×16) ×64 –3S Typ. 287 308 306 28 273 344 149 43 482 ...

  • Page 27

    ... This chapter lists all hexadecimal byte values stored in the EEPROM of the products described in this data sheet. SPD stands for serial presence detect. All values with XX in the table are module specific bytes which are defined during production. List of SPD Code Tables • Table 20 “HYS64T128020EMV-[2.5/3S](-)C2” on Page 27 Product Type Organization Label Code ...

  • Page 28

    ... DH.MIN 36 t [ns] WR.MIN t 37 [ns] WTR.MIN t 38 [ns] RTP.MIN 39 Analysis Characteristics Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules 1 GByte 1 GByte ×64 ×64 2 Ranks (×16) 2 Ranks (×16) PC2–6400M–666 PC2–5300M–555 Rev. 1.2 Rev. 1.2 HEX HEX ...

  • Page 29

    ... RDIMM Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 1 GByte ×64 2 Ranks (×16) PC2–5300M–555 Rev. 1.2 HEX ...

  • Page 30

    ... Product Type, Char 16 89 Product Type, Char 17 90 Product Type, Char 18 91 Module Revision Code Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules 1 GByte 1 GByte ×64 ×64 2 Ranks (×16) 2 Ranks (×16) PC2–6400M–666 PC2–5300M–555 Rev. 1.2 Rev ...

  • Page 31

    ... Module Manufacturing Date Week Module Serial Number 99 - 127 Not used 128 - Blank for customer use 255 Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules 1 GByte 1 GByte ×64 ×64 2 Ranks (×16) 2 Ranks (×16) PC2–6400M–666 PC2–5300M–555 Rev ...

  • Page 32

    ... Package Outlines Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules Package Outline L-DIM-214-1 Raw Card A 32 Internet Data Sheet FIGURE 5 ...

  • Page 33

    ... Values HYS 128 256 512 Internet Data Sheet HYS64T128020EMV–[2.5/3S](–)C2 Table 23. TABLE 21 Nomenclature Fields and Examples –5 – –5 TABLE 22 DDR2 DIMM Nomenclature Coding Constant Non-ECC ECC ...

  • Page 34

    ... Number of I/Os 7 Product Variations 8 Die Revision 9 Package, Lead-Free Status 10 Speed Grade Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules Values Coding –19F PC2–8500 6–6–6 –1.9 PC2–8500 7–7–7 –25F PC2–6400 5–5–5 –2.5 PC2–6400 6–6–6 – ...

  • Page 35

    ... Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.3 Speed Grade Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4 Component AC Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.5 ODT AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.6 Specifications and Conditions SPD Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6 Product Type Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Rev. 1.00, 2008-06 01242008-CDK4-KSK6 HYS64T128020EMV–[2.5/3S](–)C2 Unbuffered DDR2 SDRAM MicroDIMM Modules 35 Internet Data Sheet ...

  • Page 36

    ... Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Qimonda Office. Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...