CYIL1SM4000AA-GWCES Cypress Semiconductor Corp., CYIL1SM4000AA-GWCES Datasheet - Page 27

• Manufacturer Part Number: CYIL1SM4000AA-GWCES
• Description: 4 Megapixel CMOS Image Sensor
• Manufacturer: Cypress Semiconductor Corp.

Bonding Diagram
The die is bonded to the bonding pads of the package as shown in
Additional Package Information
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Document Number: 38-05712 Rev. *C
Die size: 25610 um X 27200 um
Cavity pad: 27000 um X 29007 um
Pixel 0,0 is located at 478 um from the left hand side of the die and 1366 um from the bottom side of the die.
Figure 25. Bonding Pads Diagram of the LUPA 4000 Package
Figure
25.
CYIL1SM4000AA
001-48359 **
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