DAC1005D650HW/C1 NXP [NXP Semiconductors], DAC1005D650HW/C1 Datasheet
DAC1005D650HW/C1
Manufacturer Part Number
DAC1005D650HW/C1
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.DAC1005D650HWC1.pdf
(41 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DAC1005D650HW/C1,5
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
Part Number:
DAC1005D650HW/C1:5
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
1. General description
2. Features
The DAC1005D650 is a high-speed 10-bit dual-channel Digital-to-Analog Converter
(DAC) with selectable 2 , 4 or 8 interpolating filters optimized for multi-carrier wireless
transmitters.
Thanks to its digital on-chip modulation, the DAC1005D650 allows the complex I and Q
inputs to be converted up from BaseBand (BB) to IF. The mixing frequency is adjusted
using a Serial Peripheral Interface (SPI) with a 32-bit Numerically Controlled Oscillator
(NCO). The phase is controlled by a 16-bit register.
Two modes of operation are available: separate data ports or a single interleaved
high-speed data port. In the Interleaved mode, the input data stream is demultiplexed into
its original I and Q data and then latched.
The DAC1005D650 also includes a 2 , 4 and 8 clock multiplier which provides the
appropriate internal clocks and an internal regulator to adjust the output full-scale current.
I
I
I
I
I
I
I
I
I
I
I
DAC1005D650
Dual 10-bit DAC, up to 650 Msps; 2 4 and 8 interpolating
Rev. 01 — 28 July 2009
Dual 10-bit resolution
650 Msps maximum update rate
Selectable 2 , 4 or 8 interpolation
filters
Input data rate up to 160 Msps
Very low noise cap-free integrated PLL
32-bit programmable NCO frequency
Dual-port or Interleaved data modes
1.8 V and 3.3 V power supplies
LVDS compatible clock
Two’s complement or binary offset
data format
3.3 V CMOS input buffers
I
I
I
I
I
I
I
I
I
I
I
IMD3: 79 dBc; f
SFDR: 75 dBc; f
f
Typical 0.95 W power dissipation at 4
interpolation
Power-down and Sleep modes
Differential scalable output current from
1.6 mA to 20 mA
On-chip 1.25 V reference
External analog offset control
(10-bit auxiliary DACs)
Internal digital offset control
Inverse (sin x) / x function
Fully compatible SPI port
Industrial temperature range from
s
40 C to +85 C
= 640 Msps; f
s
o
data
= 640 Msps; f
= 19 MHz; PLL on
= 80 MHz;
Product data sheet
o
= 96 MHz
Related parts for DAC1005D650HW/C1
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: