ADSP-TS201SABP-6X AD [Analog Devices], ADSP-TS201SABP-6X Datasheet - Page 36

• Manufacturer Part Number: ADSP-TS201SABP-6X
• Description: TigerSHARC-R Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-TS201S
ENVIRONMENTAL CONDITIONS
The ADSP-TS201S processor is rated for performance over the
extended commercial temperature range, T
85°C.
Thermal Characteristics
The ADSP-TS201S processor is packaged in a 25 mm × 25 mm
thermally enhanced Ball Grid Array (BGA_ED). The ADSP-
TS201S processor is specified for a case temperature (T
ensure that the T
heatsink and/or an air flow source may be used.
576-BALL BGA_ED PIN CONFIGURATIONS
Figure 43
ball BGA_ED package and
assignments.
1
For a more detailed pin summary diagram, see the EE-179: ADSP-TS201S System Design Guidelines on the Analog Devices website (www.analog.com)
shows a summary of pin configurations for the 576-
AA
AB
AC
AD
W
A
G
M
B
C
D
E
H
K
N
P
R
U
V
Y
F
J
L
T
CASE
data sheet specification is not exceeded, a
1
Table 28
2
3
4
lists the signal-to-ball
5
Figure 43. 576-ball BGA_ED Pin Configurations
6
CASE
7
8
= –40°C to
Rev. PrH | Page 36 of 40 | December 2003
9
10
CASE
11
). To
TOP VIEW
12
13
14
15
16
Table 27
25 mm × 25 mm BGA_ED package.
Table 27. Thermal Characteristics
for 25 mm × 25 mm Package
Parameter
17
JA
JC
JB
18
1
(top view, Summary)
19
shows the thermal characteristics of the
20
21
22
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
–
–
Preliminary Technical Data
23
24
KEY:
SIGNAL
V
V
V
V
V
V
DD
DD_IO
DD_DRAM
DD_A
REF
SS
Typical
19.6
15.4
13.7
0.7
8.3
Units
°C/W
°C/W
°C/W
°C/W
°C/W