ADSP-TS201SABP-6X AD [Analog Devices], ADSP-TS201SABP-6X Datasheet - Page 40

• Manufacturer Part Number: ADSP-TS201SABP-6X
• Description: TigerSHARC-R Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-TS201S
OUTLINE DIMENSIONS
The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced Ball Grid Array (BGA_ED) package with 24 rows of balls (BP-576).
ORDERING GUIDE
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© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00000-0-03/03(0)
Part Number
ADSP-TS201SABP-6X
ADSP-TS201SABP-X
S indicates 1.0/2.5 V supplies.
A indicates –40°C to 85°C temperature.
BP indicated thermally enhanced Ball Grid Array (BGA_ED) package.
-XX and -X indicate engineering grade products.
The instruction rate is the same as the internal DSP clock (CCLK) rate.
The BP-576 package measures 25mm × 25mm.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GR ID IS WITHIN 0.25mm OF ITS
3. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.10mm OF ITS
4. CENTER DIMENSIONS ARE N OMINAL.
5. THIS PACKAGE C ONFORMS WITH TH E JEDEC MS-034 SPECIFICATION.
1,2,3,4
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
IDEAL POSITION RELATIVE TO THE BALL GRID.
3.10 MAX
1.25
1.00
0.75
1.25
1.00
0.75
A1 BALL
INDICATOR
TOP VIEW
25.20
25.00
24.80
Case
Temperature
Range
–40°C to 85°C
–40°C to 85°C
Rev. PrH | Page 40 of 40 | December 2003
Figure 44. 576-ball BGA_ED (BP-576)
a
25.20
25.00
24.80
DETAIL A
Instruction
Rate
600 MHz
500 MHz
5
23.00
BSC
SQ
SEATING PLANE
BSC
1.00
BSC
1.00
PITCH
0.97 BSC
BALL
BSC
1.00
SQ
BALL DIAMETER
24 22
On-chip
DRAM
24Mbit
24Mbit
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21 19
Preliminary Technical Data
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BOTTOM VIEW
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DETAIL A
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16
15
14
25.20
25.00 SQ
24.80
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Operating
Voltage
1.2 V
2.5 V
1.5 V
1.0 V
2.5 V
1.5 V
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11
0.75
0.65
0.55
10
DD
DD_IO
DD_DRAM
DD
DD_IO
DD_DRAM
9
8
7
6
5
4
1.60 MAX
0.20 MAX
3
2
0.60
0.50
0.40
1
B
D
F
H
K
M
P
T
V
Y
AB
AD
Package
(BP-576)
(BP-576)
A
C
E
G
J
L
N
R
U
W
AA
AC
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