AMIS30421C4211G ONSEMI [ON Semiconductor], AMIS30421C4211G Datasheet - Page 40

• Manufacturer Part Number: AMIS30421C4211G
• Description: Micro-Stepping Stepper Motor Bridge Controller
• Manufacturer: ONSEMI [ON Semiconductor]

cooling optimizations, the NQFP has an exposed thermal
pad which has to be soldered to the PCB ground plane. The
ground plane needs thermal vias to conduct the heat to the
bottom layer.
exposed thermal pad is soldered directly on the top ground
layer (left picture of Figure 35). It’s advised to make the top
ground layer as large as possible (see arrows Figure 35). To
improve the heat transfer even more, the exposed thermal
pad is connected to a bottom ground layer by using thermal
vias (see right picture of Figure 35). It’s advised to make this
bottom ground layer as large as possible and with as less as
possible interruptions.
thermal resistances of the device are given (Table 4). The
thermal media to which the power of the devices has to be
given are:
•
•
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
ORDERING INFORMATION
Figure 35. PCB Ground Plane Layout Condition (left picture displays the top ground layer, right picture displays
AMIS30421C4211G
AMIS30421C4211RG
The AMIS−30421 is available in a NQFP44 package. For
Figure 35 gives an example of good heat transfer. The
For precise thermal cooling calculations the major
Static environmental air (via the case)
PCB board copper area (via the exposed pad)
Part No.
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Peak Current
NA
PACKAGE THERMAL CHARACTERISTICS
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the bottom ground layer)
Temperature Range
−40°C to +170°C
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40
from the junction to the ambient (Rth
from the junction to exposed pad (Rth
find the values for the Rth
to JESD−51.
JESD−51 as follows:
•
•
•
•
JESD−51 as follows:
•
•
•
The major thermal resistances of the device are the Rth
The Rth
The Rth
A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
Board thickness is 1,46mm (FR4 PCB material)
The 2 signal layers: 70 um thick copper with an area of
5500 mm
The 2 power internal planes: 36 mm thick copper with
an area of 5500 mm
A 1−layer printed circuit board with only 1 layer
Board thickness is 1.46 mm (FR4 PCB material)
The layer has a thickness of 70 mm copper with an area
of 5500 mm
10
11
1
2
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9
ja
ja
2
copper and 20% conductivity
for 1S0P is simulated conform to JEDEC
for 2S2P is simulated conform JEDEC
2
NQFP−44 (7 x 7 mm)
copper and 20% conductivity
(Pb−Free)
Package
2
copper and 90% conductivity
ja
and Rth
jp
ja
jp
, simulated according
) and the overall Rth
). In Table 4 one can
Tape & Reel
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Units / Tube
Shipping
†