HM6-6617B883 INTERSIL [Intersil Corporation], HM6-6617B883 Datasheet - Page 3

• Manufacturer Part Number: HM6-6617B883
• Description: 2K x 8 CMOS PROM
• Manufacturer: INTERSIL [Intersil Corporation]

Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage . . . . . . . . . . . GND -0.3V to VCC +0.3V
Typical Derating Factor . . . . . . . . . . . . 5mA/MHz Increase in ICCOP
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range . . . . . . . . . . . . . . . . -55
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . +2.4V to VCC +0.3V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Device Guaranteed and 100% Tested
Device Guaranteed and 100% Tested
High Level Output Voltage
Low Level Output Voltage
High Impedance Output
Leakage Current
Input Leakage Current
Standby Supply Current
Operating Supply Current
Functional Test
Address Access Time
Output Enable Access
Time
Chip Enable Access
Time
Address Setup Time
Address Hold Time
Chip Enable Low Width
Chip Enable High Width
PARAMETER
PARAMETER
SYMBOL
TGLQV
TAVQV
TELQV
TELEH
TEHEL
TELAX
TAVEL
TABLE 2. HM-6617/883 AC ELECTRICAL PERFORMANCE SPECIFICATIONS
TABLE 1. HM-6617/883 DC ELECTRICAL PERFORMANCE SPECIFICATIONS
SYMBOL
ICCOP
ICCSB
VOH1
VOL
IIOZ
FT
II
VCC = 4.5V and 5.5V
(Note 5)
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
VCC = 4.5V and 5.5V
(NOTES 1, 2, 4)
CONDITIONS
VCC = 4.5V, IO = -2.0mA
VCC = 4.5V, IO = +4.8mA
VCC = 5.5V, G = 5.5V,
VI/O = GND or VCC
VCC = 5.5V, VI = GND or
VCC, P Not Tested
VI = VCC or GND,
VCC = 5.5V, IO = 0mA
VCC = 5.5V, G = GND,
(Note 3), f = 1MHz, IO =
0mA, VI = VCC or GND
VCC = 4.5V (Note 6)
CONDITIONS
(NOTES 1, 4)
o
C to +125
HM-6617/883
SUBGROUPS
GROUP A
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
o
C
6-252
SUBGROUPS
GROUP A
Thermal Information
Thermal Resistance
Maximum Storage Temperature Range . . . . . . . . .-65
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +175
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5473 Gates
7, 8A, 8B
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
SBDIP Package . . . . . . . . . . . . . . . . . .
Slim SBDIP . . . . . . . . . . . . . . . . . . . . .
CLCC Package . . . . . . . . . . . . . . . . . .
-55
-55
-55
-55
-55
-55
-55
TEMPERATURE
o
o
o
o
o
o
o
C
C
C
C
C
C
C
TA
TA
TA
TA
TA
TA
TA
-55
-55
-55
-55
-55
-55
-55
TEMPERATURE
+125
+125
+125
+125
+125
+125
+125
o
o
o
o
o
o
o
C
C
C
C
C
C
C
o
o
o
o
o
o
o
C
C
C
C
C
C
C
TA
TA
TA
TA
TA
TA
TA
HM-6617B/883
MIN
+125
+125
+125
+125
+125
+125
+125
15
20
95
40
-
-
-
LIMITS
o
o
o
o
o
o
o
C
C
C
C
C
C
C
MAX
105
40
90
-
-
-
-
MIN
-1.0
-1.0
2.4
-
-
-
-
HM-6617/883
48
65
58
LIMITS
MIN
120
20
25
40
-
-
-
o
o
o
LIMITS
JA
C/W
C/W
C/W
MAX
100
0.4
1.0
1.0
20
MAX
-
-
140
120
50
-
-
-
-
o
C to +150
14
19
9
o
UNITS
UNITS
o
o
C/W
JC
C/W
C/W
mA
ns
ns
ns
ns
ns
ns
ns
V
V
A
A
A
o
o
o
C
C
C