HM6-6617B883 INTERSIL [Intersil Corporation], HM6-6617B883 Datasheet - Page 7

• Manufacturer Part Number: HM6-6617B883
• Description: 2K x 8 CMOS PROM
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
140 x 232 x 19
Type: Si - Al
Thickness: 11k
Å
1mils
15k
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Å
A3
A2
A1
A0
Q0
A4 A5
Q1
Q2
HM-6617/883
GND
A6 A7
HM-6617/883
6-256
Q3
GLASSIVATION:
WORST CASE CURRENT DENSITY:
VCC
Q4
Type: SiO
Thickness: 7k
1.7 x 10
A8 A9
Q5
5
2
A/cm
Q6
Å
2
P
9k
Å
G
A10
E
Q7