HYS64D16000GDL-6-C Infineon, HYS64D16000GDL-6-C Datasheet
HYS64D16000GDL-6-C
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HYS64D16000GDL-6-C Summary of contents
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HYS64D32020[H/G]DL–5–C HYS64D[32020/16000][H/G]DL–6– ...
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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HYS64D32020[H/G]DL–5–C HYS64D[32020/16000][H/G]DL–6– ...
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... We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: techdoc.mp@infineon.com I Currents dd Template: mp_a4_v2.0_2003-06-06.fm ...
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... Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2 Current Specification and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.3 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 SPD Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 5 Rev. 1.0, 2004-03 ...
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... The HYS64D32020[H/G]DL–5–C and HYS64D[32020/16000][H/G]DL–6–C are industry standard 200-Pin Small Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M × 64 and 16M × 64. The memory array is designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are mounted on the PC board ...
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... Table 2 Ordering Information Type PC3200 (CL=3.0) HYS64D32020GDL–5–C PC2700 (CL=2.5) HYS64D16000GDL–6–C HYS64D32020GDL–6–C PC3200 (CL=3.0) HYS64D32020HDL–5–C PC2700 (CL=2.5) HYS64D16000HDL–6–C HYS64D32020HDL–6–C Notes 1. All part numbers end with a place code designating the silicon-die revision. Reference information available on request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components. 2. The Compliance Code is printed on the module labels describing the speed sort (for example “ ...
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... Note: 1-rank module 17 Row Address 6 Strobe 8 Column Address 14 Strobe 18 Write Enable 19 23 Bank Address Bus 29 1 Small Outline DDR SDRAM Modules Pin Configuration Pin Configuration of SO-DIMM (cont’d) Name Pin Buffer Function Type Type A0 I SSTL Address Bus 11 SSTL A2 I SSTL A3 ...
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... Data Bus 63:0 172 176 177 181 187 189 178 182 188 190 Small Outline DDR SDRAM Modules Pin Configuration Pin Configuration of SO-DIMM (cont’d) Name Pin Buffer Function Type Type DQ54 I/O SSTL Data Bus 63:0 DQ55 I/O SSTL DQ56 I/O SSTL ...
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... Data Mask 8 Note: ECC type module Note: Non-ECC module Serial Bus Data Select Bus 2:0 10 Small Outline DDR SDRAM Modules Pin Configuration Pin Configuration of SO-DIMM (cont’d) Name Pin Buffer Function Type Type V AI – I/O Reference REF ...
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... Buffer Function Type Type NC NC – Not connected Note: Pins not connected on Infineon SO DIMMs Abbreviations for Pin Type Standard input-only pin. Digital levels. Output. Digital levels. I bidirectional input/output signal. Input. Analog levels. Power Ground Not Connected (JEDEC Standard) Abbreviations for Buffer Type ...
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... Pin 191 - Pin 195 - Pin 199 SDRAMs # row/bank/ SDRAMs columns bits 16M ×16 4 13/2/9 16M ×16 8 13/2/9 12 Small Outline DDR SDRAM Modules Pin Configuration Pin 002 V Pin 004 - SS Pin 006 Pin 008 - DQ6 Pin 010 Pin 012 - DM0 Pin 014 V Pin 016 ...
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... Block Diagram Raw Card C ×64 1 Rank ×16 Figure 2 Notes therefore strap open DD DDQ DDID 2. DQ, DQS, DM resistors are 22 3. BAn, An, RAS, CAS, WE resistors are 7.5 Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules V DDSPD DDQ V REF V V DDID DM3 LDM CS DQS3 LDQS DQ24 ...
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... I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDM UDQS I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 3. BAn, An, RAS, CAS, WE resistors are 22 ohms +/- 5% 14 Small Outline DDR SDRAM Modules Pin Configuration V : SPD EEPROM E0 DD,SPD SDRAMs DDQ DD DDQ SDRAMs REF REF SDRAMs ...
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... DDQ DDQ V V – 0.04 REF 0.15 REF V –0.3 V –0.3 V 0.36 0.71 1.4 15 Small Outline DDR SDRAM Modules Electrical Characteristics Values Unit Note/ Test Condition V +0.5 V – DDQ +3.6 V – +3.6 V – +3.6 V – °C +70 – °C +150 – – W – – ...
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... REF V stabilizes. REF 16 Small Outline DDR SDRAM Modules Electrical Characteristics Unit Note/Test Condition µA Any input 0 V ≤ All other pins not under test 7) µA DQs are disabled; ...
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... Auto-Refresh Current burst refresh RC RFCMIN Self-Refresh Current CKE ≤ 0.2 V; external clock on Operating Current 7 four bank interleaving with Burst Length = 4; see component data sheet. Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules V IL,MAX V ; IH,MIN for DQ, DQS and DM; ...
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... values of the component data sheet as follows: DDx [component] with m and n number of components of rank 1 and 2; n=0 for 1 rank data sheet values as × I DDx 18 Small Outline DDR SDRAM Modules Electrical Characteristics Unit 256MB ×64 2 Ranks –6 Typ. Max. 404 480 ...
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... DQS falling edge hold time from CK (write cycle) Mode register set command cycle time Write preamble setup time Write postamble Write preamble Address and control input setup time Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Symbol –5 DDR400B Min. Max. Min. t –0.5 +0.5 –0.7 ...
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... DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on 9) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules Symbol –5 DDR400B Min. ...
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... OH(ac) 11) For each of the terms, if not already an integer, round to the next highest integer. cycle time. 12) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device. Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules V . OL(ac) 21 Electrical Characteristics t is equal to the actual system clock CK Rev ...
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... Module Density per Rank 32 tAS, tCS [ns] Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules HYS64D32020GDL–5–C HYS64D32020HDL–5–C 256 MB 256 MB ×64 ×64 2 Ranks 2 Ranks PC3200S–3033–1 PC3200S–3033–1 Rev 1.0 Rev 1 ...
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... DIMM PCB Height not used 62 SPD Revision 63 Checksum of Byte 0-62 64 JEDEC ID Code of Infineon ( JEDEC ID Code of Infineon ( Module Manufacturer Location 73 Part Number, Char 1 74 Part Number, Char 2 75 Part Number, Char 3 76 Part Number, Char 4 77 Part Number, Char 5 ...
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... Description 91 Module Revision Code 92 Test Program Revision Code 93 Module Manufacturing Date Year 94 Module Manufacturing Date Week Module Serial Number ( 127 Blank Table 14 SPD Codes for HYS64D[32020/16000][H/G]DL–6–C Part Number & Organization Label Code Jedec SPD Revision Byte# Description 0 ...
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... Module Density per Rank 32 tAS, tCS [ns] 33 tAH, TCH [ns] 34 tDS [ns] 35 tDH [ns not used Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 128MB 128MB 256MB ×64 ×64 ×64 1 Rank 1 Rank 2 Ranks –6 –6 –6 PC2700S– PC2700S– ...
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... SPD Revision 63 Checksum of Byte 0-62 (LSB only) 64 JEDEC ID Code for Infineon( JEDEC ID Code for Infineon(2 -8) 72 Module Manufacturer Location 73 Part Number, Char 1 74 Part Number, Char 2 75 Part Number, Char 3 76 Part Number, Char 4 77 ...
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... Part Number, Char 18 91 Module Revision Code 92 Test Program Revision Code 93 Module Manufacturing Date Year 94 Module Manufacturing Date Week Module Serial Number ( -127 not used Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 128MB 128MB 256MB ×64 × ...
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... Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 4 Package Outlines – Raw Card C DDR-SDRAM SO-DIMM HYS64D16000[G/H]DL–6–C Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C 67.6 63.6 (2.45) ±0.1 ±0.1 47.4 ±0.1 (2.15) ±0.1 200 0.45 ±0.03 28 Small Outline DDR SDRAM Modules Package Outlines 2.4 MAX. 100 1 ±0.1 L-DIM-200-011 Rev. 1.0, 2004-03 0.15 ...
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... MIN. Detail of contacts 0.6 ±0.1 Burnished, no burr allowed Figure 5 Package Outlines – Raw Card A DDR SDRAM SO-DIMM HYS64D32020[G/H]DL–5/6]–C Data Sheet HYS64D[32020/16000][H/G]DL–[5/6]–C Small Outline DDR SDRAM Modules 67.6 63.6 ±0.1 (2.45) 100 ±0.1 47.4 ±0.1 (2.15) 200 0.45 ±0.03 29 Package Outlines 3 ...
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... Published by Infineon Technologies AG ...