HYS64D16000GDL-6-C Infineon, HYS64D16000GDL-6-C Datasheet - Page 7

• Manufacturer Part Number: HYS64D16000GDL-6-C
• Description: 200-Pin Small Outline Dual-In-Line Memory Modules
• Manufacturer: Infineon

Table 2
Type
HYS64D32020GDL–5–C
HYS64D16000GDL–6–C
HYS64D32020GDL–6–C
HYS64D32020HDL–5–C
HYS64D16000HDL–6–C
HYS64D32020HDL–6–C
Notes
1. All part numbers end with a place code designating the silicon-die revision. Reference information available on
2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the
1) RCD: Row-Column-Delay
Data Sheet
PC3200 (CL=3.0)
PC2700 (CL=2.5)
PC3200 (CL=3.0)
PC2700 (CL=2.5)
request. Example: HYS64D32020GDL-6-B, indicating rev. B dies are used for SDRAM components.
latencies and SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD
3 clocks, Row Precharge latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card
used for this module.
Ordering Information
PC3200S–3033–1–A1
PC2700S–2533–0–A1
PC3200S–3033–1–A1
PC2700S–2533–0–C1
PC2700S–2533–0–A1
Compliance Code
PC2700S–2533–0–C1
7
Description
two ranks 256 MB SO-DIMM
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
two ranks 256 MB SO-DIMM
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
HYS64D[32020/16000][H/G]DL–[5/6]–C
Small Outline DDR SDRAM Modules
SDRAM
256 MBit (×16)
256 MBit (×16)
256 MBit (×16)
256 MBit (×16)
256 MBit (×16)
Technology
256 MBit (×16)
Rev. 1.0, 2004-03
Description
1)
latency of