HYS64D16000GDL-6-C Infineon, HYS64D16000GDL-6-C Datasheet - Page 6

• Manufacturer Part Number: HYS64D16000GDL-6-C
• Description: 200-Pin Small Outline Dual-In-Line Memory Modules
• Manufacturer: Infineon

200-Pin Small Outline Dual-In-Line Memory Modules
SO-DIMM
1
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Table 1
Part Number Speed Code
Speed Grade
max. Clock Frequency
2
The HYS64D32020[H/G]DL–5–C and HYS64D[32020/16000][H/G]DL–6–C are industry standard 200-Pin Small
Outline Dual-In-Line Memory Modules (SO-DIMMs) organized as 32M × 64 and 16M × 64. The memory array is
designed with Double Data Rate Synchronous DRAMs (DDR SDRAM). A variety of decoupling capacitors are
mounted on the PC board. The DIMMs feature serial presence detect based on a serial E
2-pin I
available to the customer.
Data Sheet
Non-parity 200-Pin Small Outline Dual-In-Line Memory Modules
One rank 16M ×64 and two ranks 32M ×64 organization
JEDEC standard Double Data Rate Synchronous DRAMs (DDR SDRAM)
Single +2.5 V (± 0.2 V) power supply
Built with 256 Mbit DDR SDRAMs organised as ×16 in P–TSOPII–66–1 packages
Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All inputs and outputs SSTL_2 compatible
Serial Presence Detect with E
Jedec standard form factor: 67.60 mm × 31.75 mm × 2.4 / 3.80 mm
Jedec standard reference layout Raw Cards A and C
Gold plated contacts
2
C protocol. The first 128 bytes are programmed with configuration data and the second 128 bytes are
Overview
Features
Performance
Description
2
PROM
Component
Module
@CL3
@CL2.5
@CL2
f
f
f
CK3
CK2.5
CK2
6
–5
DDR400B
PC3200–3033
200
166
133
HYS64D[32020/16000][H/G]DL–6–C
–6
DDR333B
PC2700–2533
166
166
133
HYS64D32020[H/G]DL–5–C
2
PROM device using the
Rev. 1.0, 2004-03
Unit
—
—
MHz
MHz
MHz